Electronics Forum: cartridge wall mounted (Page 1 of 4)

solder paste

Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef

Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c

Attenna assembly for RF board

Electronics Forum | Fri Jan 29 15:39:04 EST 1999 | Chris Jackson

I have a recent design (1 component side only) that calls for 2 surface mounted antenna's (brass plated) to be mounted on a PCB. The problem arises when the PCB is 18x11.25 and has 15 to 20 PCB's in the pallet (IE weight, fixturing to hold the anten

Re: Attenna assembly for RF board

Electronics Forum | Sun Jan 31 14:03:41 EST 1999 | Dean

| I have a recent design (1 component side only) that calls for 2 surface mounted antenna's (brass plated) to be mounted on a PCB. The problem arises when the PCB is 18x11.25 and has 15 to 20 PCB's in the pallet (IE weight, fixturing to hold the ant

Re: Solder paste recovery

Electronics Forum | Fri Dec 01 12:02:15 EST 2000 | blnorman

I have over 10 years experience in aerospace materials, part of which was involved with vacuum casting inert propellant formulations. These propellants are in the range of 80 - 90% solids loaded with viscosities of 15 kP. I'm not sure where I could

Nitrogen supply for new solder wave spray fluxer.

Electronics Forum | Tue Mar 07 21:28:30 EST 2023 | stephendo

What purity? To get 99.999% pure you will need dewers of liquid nitrogen or a two stage system. (and a dewer will last about a month and a half even if you don't use it as it outgasses.) But you can get reasonable purity with a wall mounted single s

Positive Pressure Facility

Electronics Forum | Thu Apr 07 08:02:44 EDT 2005 | Grant

Hi, I used to run a clean room, and it's right, most of the dust is created internally. You will need to add some HEPA filtering to the area, and an air handling unit that can control temp and humidity as well to get correct environmental control.

Micro Leadless Frame - solder wetting control

Electronics Forum | Wed May 08 23:18:58 EDT 2002 | ianchan

Hi mates, have this SMT production issue : A) We have a leadless-chip-carrier(LCC) IC package that is classified under the Land-Grid-Array(LGA) package family. B) The LCC is 4mm x 4mm, and has 28 tin plated pads located beneath the outside perimet

Re: Attenna assembly for RF board

Electronics Forum | Tue Feb 02 10:18:56 EST 1999 | Justin Medernach

| I have a recent design (1 component side only) that calls for 2 surface mounted antenna's (brass plated) to be mounted on a PCB. The problem arises when the PCB is 18x11.25 and has 15 to 20 PCB's in the pallet (IE weight, fixturing to hold the ant

Re: Attenna assembly for RF board

Electronics Forum | Tue Feb 16 13:57:50 EST 1999 | Ron Beasley

| | I have a recent design (1 component side only) that calls for 2 surface mounted antenna's (brass plated) to be mounted on a PCB. The problem arises when the PCB is 18x11.25 and has 15 to 20 PCB's in the pallet (IE weight, fixturing to hold the a

Re: Solder Paste volume w/reliability data.

Electronics Forum | Fri Jul 30 17:13:30 EDT 1999 | Dave F

| | | Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly

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