Electronics Forum | Fri Apr 21 14:22:45 EDT 2023 | padawanlinuxero
Do all of the above (robgd3) In my case the problem was a motor inside the moving head started to give up so it kinda miss the synchro with the other motor on the outside, and in my case we bought the new motor but it took several day to fix with the
Electronics Forum | Thu Nov 08 06:57:50 EST 2012 | pgarsoe
Murata designed the system: Promoting the Adoption of Bulk Cases An industry standard specification for bulk cases was adopted in March 1992. Although Murata holds the industrial property rights for this type of bulk case, we are encouraging its wid
Electronics Forum | Wed Aug 30 05:39:00 EDT 2017 | alexandrdmc
Set 3-pieces, Swimming Mobile Phone Waterproof Dry Bag, iphone waterproof pouch. It is not only have Waterproof effect, it's also can usd the normal use of the phone function, such as Touch, take pictures, send text messages, answer the phone and so
Electronics Forum | Wed May 16 08:48:12 EDT 2001 | ohboy
I been a bunch o' places...! Some good, some bad, re-inventing the wheel in many cases. Our specs are pretty specific in a lot of cases, but that doesn't mean they always get followed. It usually becomes a case of "It's not quite right, but we rea
Electronics Forum | Tue Jan 12 17:03:59 EST 1999 | Ryan Jennens
How is everybody? I was asked about any problems that would be associated with having a plastic casing injection molded around an assembled PCB. I am not sure if injection molded plastic has to be hot, I am assuming so (can they use epoxies?).
Electronics Forum | Tue Feb 19 11:08:22 EST 2002 | Chris Anglin
Guideline for Tenting Interstitial BGA Vias It is difficult to give a complete recommendation on via tenting without an idea what process conditions are required (ex: wave pass, double reflow, rework etc.). Via Pads (as Test Points) - On Bottom
Electronics Forum | Mon May 20 10:49:12 EDT 2002 | geoff_goring
Are we saying then that IMC can occur at the solder / Cu pad join on the PCB when finished assembled? In our case we are being told that this process is starting before assembly. Is it fundamentally the same thing. i.e. will the Tin diffuse with th
Electronics Forum | Wed Nov 20 18:41:57 EST 2002 | slthomas
Here's part of what I could read: "We evaluated the influence of Lift-off (Fillet-lifting) and the influence of thermal fatigue, in this case on combination between various terminal platings of electronic components and Pb-free solder, Sn-37Pb solde
Electronics Forum | Wed Feb 08 03:35:58 EST 2006 | GS
100�C) the moisture changes in vapour/gas generating an internal pressure causing in the worst case damages like internal planes delamination, popcorn effects, degassing, ecc. So you can understand why before reflow it could be necessary to backe and
Electronics Forum | Wed May 24 15:59:34 EDT 2006 | JohnM
I have a product with mixed in Pb free and Pb BGAs. I decide to use SnPb paste with Pb free reflow profile to make it work for both types of BGA. Do I have a reliability solder joint issue by using this method? How is your opinion on this case? Can
