Electronics Forum: casing (Page 110 of 247)

BGA flux dipping process

Electronics Forum | Mon Jun 15 15:33:51 EDT 2009 | hegemon

IMHO I would suggest that if you are using flux only during a BGA placement on a small run, that you first tin the pads with your soldering iron, then level the pads back out with wick. Accomplishes two things; adds a little metal to the joint to ma

ESD....Limiting Resistor

Electronics Forum | Mon Jun 29 16:53:02 EDT 2009 | Geo

I need some help in setting straight QA which owns our ESD Procedures. 1. Is the limmiting resistor for personel safety or to slow down ESD discharge? Everything I have read indicates it is for personnel safety. 2. Is it an ESD violation to have

ESD....Limiting Resistor

Electronics Forum | Wed Jul 01 06:29:59 EDT 2009 | rway

You are correct. The resistors are for personal safety. However, I don't think that bench top or floor mats require a 1MO current-limiting resistor. This would be necessary if a wrist strap was being used. The mats we use do have a 1MO resistor o

field service engineers/technicians for Philips FCM II

Electronics Forum | Mon Jul 06 09:37:11 EDT 2009 | esolano

Hi, I thank you for your response. It is a very small job and we do require help from within Ontario Canada to keep this operation cost effective. If you want us to keep you on the list in case we require your help in future, please send me

Flip Chip Solder Ball Attach

Electronics Forum | Wed Aug 05 11:08:36 EDT 2009 | spitkis2

Hi, This may be a bit off the subject but thought I'd ask just in case. I am looking to identify a process / equipment for attaching solder balls to flip chips. Solder balls are 75 microns in diameter. With BGA's there are reballing kits that use

Low Silver Solder Problems

Electronics Forum | Sat Aug 22 15:12:32 EDT 2009 | rossi

Thank you for replying. 1) the finish is Gold Immersion (ENIG) 2) paste type EM907 SN96.5/AG3.0/CU0.5 3) it is always the same BGA but its not on the same ball every time. It is always at the joint on the PCB pad like the solder is not sticking prope

Low Silver Solder Problems

Electronics Forum | Wed Aug 26 05:13:01 EDT 2009 | grahamcooper22

Hi, as you are using Vapour phase reflow what temperature is the boiling point of the solvent you are using ? If it is @ 250 C then you should be getting everything hot enough to melt the ball and solder paste together. If this is the case then your

Solder Wire Expiry Dates

Electronics Forum | Wed Aug 26 10:48:30 EDT 2009 | grahamcooper22

Some print expiry date on reels and some specify a shelf life on data sheets. Two main reasons are that the flux in the wire is a mix of chemicals and over time in storage these can react so soldering performance can be changed. Although I have to sa

solder paste volume model

Electronics Forum | Tue Sep 22 10:29:18 EDT 2009 | stepheniii

To how many decimal places? Do you want to have a factor for different screen printer operators? There is no such formula and I doubt there ever will be one with any real accuracy. The stencil house might be able to tell you the total area of the

Gluing Quality Issue !!!

Electronics Forum | Thu Nov 05 16:56:38 EST 2009 | lynn_norman

In a previous job, we had torque off requirements for different sized components for our screen print adhesive (non-conductive in our case). We used a torque watch that would measure max torque, so we could test production boards, shear testing was


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