Electronics Forum: casing (Page 115 of 247)

Nickel Silver Reflow Process - Specifics

Electronics Forum | Fri Feb 15 05:36:07 EST 2013 | adrianus

Hi Dave, We do not reflow those parts but are merely a supplier. Therefore I need to have our application specs in order. So, in case the customer has a problem I want to be able to properly support the customer. Hence, I'm curious about the details

Open board SiP PCB warpage measurement

Electronics Forum | Tue May 21 15:37:36 EDT 2013 | armelinda

I am looking for a service providing non contact PCB flatness measurement for open board SiP assembly. It was returned for failure analysis with complaint that assembly does not solder properly onto customer system board. Since there are remnants o

Need a Wave solder profiler, Any suggestions??

Electronics Forum | Tue Jun 04 09:46:54 EDT 2013 | markhoch

While both of those products do make it easier to profile the wave, a standard reflow oven profiler, with some long thermocouples, are all you really need. You can even use the standard Thermocouples and send the profiler through the oven on a traili

SMT solder Covering component surface

Electronics Forum | Mon Jul 01 13:19:55 EDT 2013 | emeto

I always look for a toe fillet if the design allows you to. Many times the pad design is close or exactly the size of the leads which makes people to touch it up right away. I told them hundred times not to but...Luckily I have 3D x-ray and I can tel

SD Card holder solderability

Electronics Forum | Mon Jul 01 11:29:02 EDT 2013 | hegemon

I am guessing a lead free process. From the pictures, I don't neccessarily see any issues, perhaps the leads have wicked up a little too much solder, making the joint look a little starved. But I think I see nice toe and side fillets. In the worst c

solder joint problem

Electronics Forum | Fri Jul 26 05:14:38 EDT 2013 | anilw2006

We had a solder joint problem in gold plated PLCC68 ic. We do double sided reflow process with Cookson OL107F paste. First we do top with paste and second with glue process.The solder joint shape and wetting looked normal.In the process of testing

Using RoHS Components in a leaded paste world

Electronics Forum | Thu Oct 31 11:54:10 EDT 2013 | ke6zoy

I work in a leaded paste world due to aerospace environmental requirements. There are a few cases where parts are only available from suppliers as RoHS. Can anyone recommend how to process these into a leaded assembly? Is it just reflowing at a hi

Using RoHS Components in a leaded paste world

Electronics Forum | Thu Oct 31 12:33:14 EDT 2013 | pbarton

You should have no difficulty with QFN or QFP parts when using non-RoHS solder. The QFP's are most likely to have tin plated leads and the metallisation on the QFN lands the same, or ENIG. Check the component part datasheets to verify the plating an

Using RoHS Components in a leaded paste world

Electronics Forum | Thu Oct 31 12:37:37 EDT 2013 | pbarton

You should have no difficulty with QFN or QFP parts when using non-RoHS solder. The QFP's are most likely to have tin plated leads and the metallisation on the QFN lands the same, or ENIG. Check the component part datasheets to verify the plating an

Expected pick and place precision for 0603 LEDs?

Electronics Forum | Wed Nov 13 16:48:19 EST 2013 | spoiltforchoice

I would expect any half decent machine to place 0603 parts slap bang on target to the typical defined accuracy for such parts on most machines of perhaps ~60 microns or better. Self correction during reflow is IMHO much less pronounced with lead-free


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