Electronics Forum | Tue Nov 04 10:08:22 EST 2008 | dphilbrick
We have a version of an ERP called Catalyst. It was developed within Ga Tech and then privatized. http://www.catalyst-mfg.com is their link. It is a really versatile system and handles PCBA operations very well. It also comes in an open license versi
Electronics Forum | Mon Aug 30 14:56:07 EDT 2010 | davef
Search the fine SMTnet Archives for background discussions on Manex, DBA, Catalyst, SAP in a box ...
Electronics Forum | Mon May 15 06:20:19 EDT 2017 | punarsin
Please suggest some extra course that can catalyst career in PCB assembling and manufacturing field.
Electronics Forum | Mon Apr 01 07:45:50 EDT 2024 | ormsystems
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Electronics Forum | Wed Aug 11 07:41:52 EDT 2004 | gregoryyork
Check cure of solder resist. Use a No clean low solids rosin flux this will stop problem. Should see almost zero solder balls if put through a single wave compared to a dual wave. If this is true then it is a resist issue and cannot 'resist' the sold
Electronics Forum | Fri May 25 13:24:38 EDT 2007 | mfgengr
I had a similar problem a long time ago. I eventually traced the problem to undercured solder resist. The flux was reacting with what was left of the uncured resist, leaving a white residue. We could not even hand scrub this off. The solution was to
Electronics Forum | Thu Feb 22 20:53:44 EST 2001 | davef
You're not sposed to pull the mask from the BGA when reworking it!!!! ;-) Well, if you insist. You can be as fancy as you want. Basically, all you need to do form a dam to prevent the solder from flowing from the pad to the via and starving the
Electronics Forum | Tue Sep 07 16:24:33 EDT 1999 | Jason Gregory
| | Last Thursday I resigned from my position as manager of SMTnet. I want to personally thank all SMTnet viewers, editors, customers, colleagues, and others for your support to me in the creation and expansion of SMTnet over the last four years. I
Electronics Forum | Fri Mar 07 15:20:11 EST 2003 | davef
O'Connor: IPC-A-610, section 12.4.4 SMT Soldering Anomolies - Nonwetting was added primarily to accomidate OSP boards. Heated flux is used to remove the 'lacguer'. So, you end-up with a copper colored border [or shadow] around the pads, where there
Electronics Forum | Thu Feb 27 16:23:37 EST 2020 | dwl
http://www.circuitnet.com/news/uploads/3/Comparing-Soldering-Results-of-ENIG-and-EPIG-Post-Steam-Exposure.pdf Years ago, I battled this problem. ENIG PCBs reflowed with active WS flux. We built one side, and then washed them because they were going
