Electronics Forum | Thu Nov 13 11:45:04 EST 2008 | pbarton
We have seen a similar problem. Turned out to be mechanical stress on the component caused by the method of location and clamping at ICT. Where is the component located on the assembly? Poorly adjusted clamping pillars on clamshell fixtures can cause
Electronics Forum | Thu Nov 13 09:14:52 EST 2008 | raiders
Hi All, We encounter capacitor crack in the ICT, it contributes 2% of the failure. We are not sure whether these crack coming from the SMT. All these crack having the same pattern. Please refer to attached file. Anybody encounter the same thing befo
Electronics Forum | Thu Nov 13 13:07:04 EST 2008 | vladig
Yes, it does look like a typical crack due to mechanical overloading (bending) of teh component. Usually because of the board flexing Vlad
Electronics Forum | Wed Jul 10 04:53:47 EDT 2002 | redmary
a leakage exists in the capacitor net (1206), which cause the voltage down so much. the process flow is: printing-placement-reflow-hand load-wave-depanel-FT. I find possible stress maybe exists in the depanel stage, does the extra stress cause the ca
Electronics Forum | Fri Jul 12 01:38:06 EDT 2002 | redmary
thanks, Dave. who are specialized in mechnical stress distribution? because I find the gap in the capacitor, but why? If the crack is caused by the exteral mechnical stress, which shape will be formed, zigzag or linear?
Electronics Forum | Wed Jul 10 18:19:42 EDT 2002 | davef
Flex cracking under the terminations is generally regarded as one of the primary causes of failure of ceramic chips. If you can see cracks in the solder joints from board flex, those chips are certainly strongly suspect, and you must assume there is
Electronics Forum | Fri Oct 29 02:07:48 EDT 1999 | Eom In Soub
hi. guys Have you out there ever seen the crack by means of humidity after reflow solering. We cannot analyze the cause of the tsop crack. The shape of crack seem to be hitted by sharp stuff. but there is no scar around crack . TSOP shaped long rec
Electronics Forum | Fri Apr 13 05:07:57 EDT 2001 | zam_bri
Hi Dave, Thanx for your reply. What is it in the process of manufacturing the capacitor that can go wrong until it can caused the chips to be chipped-off or cracks. I've encountered alot of this problem lately. First I thought it was our process t
Electronics Forum | Mon Aug 21 04:20:49 EDT 2006 | Rob
Hi Mika, I used to work for the largest chip cap manufacturer in the world, and by far the largest problem we would see was cracking due to incorrect z height adjustment on Chipshooters. It can also cause solderballs and bad joints by displacing th
Electronics Forum | Sat Aug 19 21:06:09 EDT 2006 | mika
Hi all, At our Fuji CP-6 machines we place a lot of 0402:s, 0603:s and 0805:s chip capacitors. Our problem is that the height of the components can sometime be very extreme from different vendors. I am sure you all have experience of this phenomenon
