Electronics Forum | Fri Jan 25 19:01:35 EST 2013 | hegemon
My first guess is that the plating in the barrel (via) has failed and allowed laminate/epoxy egress into the barrel and out to the surface of the board. Just a guess based on the picture.... 'hege
Electronics Forum | Thu Feb 14 17:40:34 EST 2013 | jorge_quijano
PCB Supplier made an EDX anaysis, the found a chemical trapped in the holes, and some burnt burrs, according to what they say this stains are over the solder mask & silk, so they do not affect functionality.
Electronics Forum | Sat Jan 26 21:33:39 EST 2013 | sarason
Looks like you have a carbon black process that isn't quite plating to completion, pin prick size holes have remained in the plating. When dipped in an etchant (ie any acid or H2O) the holes grow and they leak carbon. This may be more of a problem th
Electronics Forum | Fri Feb 22 16:32:56 EST 2013 | davef
Jorge: I took this total posting to several fabs at IPC APEX. None was satisfied with the answers you receive from your supplier or the Forum members. They suggested that you get your board analyzed. They were surprised that your supplier didn't in
Electronics Forum | Fri Jan 25 14:20:31 EST 2013 | jorge_quijano
Hi there, I have a new product today, after reflow oven I've seen a black stain coming from various holes, they can be cleaned with a tissue but some of the contaminant remains inside, we are using Sn63Pb37, the stains are far from soldering areas, t
Electronics Forum | Thu Aug 18 00:19:09 EDT 2016 | souldierann
Hi there. would it be possible that thermal relief pads for relay bring bad solder?
Electronics Forum | Thu Aug 18 20:10:06 EDT 2016 | souldierann
Hi SweetOldBob, how did you say then?
Electronics Forum | Fri Sep 09 05:32:11 EDT 2016 | jasltd
Are your solder relief pads connected to anything in terms of ground planes that would increase the thermal load or are they floating copper? I take it your talking about wave solder relief pads?
Electronics Forum | Fri Jul 06 03:23:01 EDT 2001 | kennyhktan
Hi there Steven ! Please allow me to share some of my problem we're facing here with you. Here are a few points that I suggest you should check on your current process:- (1)PCB - Component land partern design ? It is per IPC spec ? - Mask
