Electronics Forum | Mon Jul 01 15:37:56 EDT 2002 | pjc
Possible cause can be design related- if the solder land is too small. Check w/ IPC SM-782 Solder Land Design Guide Another is board finish. I have seen problems like this with Gold finished PWBs- which creates a more brittle solder joint.Another pos
Electronics Forum | Wed Aug 10 10:41:23 EDT 2005 | patrickbruneel
Bob, Great theory if you're selling SN100C, but I have to disagree that an alloy being 4�C off eutectic will cause cracks. When a solder joint exits the solder wave, there is an immediate drop in temperature of 100�C. so being off 4�C is irrelevant.
Electronics Forum | Wed Aug 03 21:29:59 EDT 2005 | Ken
Yes, lead can promote fillet lift. In order to understand this defect you must begin looking at your lead frame mateials. some lead frames are more susceptable to this disorder. This is most likely a cte mismatch disorder. Lead contamination in
Electronics Forum | Wed Aug 10 09:01:15 EDT 2005 | fctassembly
Hello Joseph, Sorry for the bad news but microcracking is a well known potential condition occuring with the SAC305 alloy. Microcracking is a condition being seen with many joints soldered with the SAC305 alloy. It is technically a shrinkage cavity
Electronics Forum | Fri May 31 05:54:09 EDT 2019 | dhanish
What are the common cause for solder joint crack after the pcba go through Temperature cycling test ?We have seen failure on solder joint for the memory part.
Electronics Forum | Tue Aug 02 22:49:55 EDT 2005 | davef
IPC-A-610D Section 5, shows a variety of photographs of: * Good lead-free solder connections * Lead-free soldering anomalies Hot Tear / Shrink Hole is one such anomaly. This shrinkage effect appears primarily on wave-soldered joints, but can also
Electronics Forum | Mon Aug 01 20:02:20 EDT 2005 | Joseph
We use SAC305 and top side particular joint temp. is 110 deg C, and the terminal finish for that particular lead is pure tin. It look like hot tearing at the primary side of PTH.
Electronics Forum | Mon Aug 01 06:59:02 EDT 2005 | Joseph
Dear all, We observed visible micro crack at top side of solder fillet during lead free wave solder process. We did not see any visible micro crack at bottom side, and it always located at joints of transformer. Any input be much appreciated. Best
Electronics Forum | Tue Nov 13 21:59:42 EST 2007 | davef
This processes has the potential to cause barrel cracking and pad lifting, because the heating is very hot [troop crank-up the volume on their iron when they see thick boards] for a relatively small area on one side of the board. What do we suggest
Electronics Forum | Fri May 31 10:15:30 EDT 2019 | davef
Major sources of crack in the solder connection after thermal cycling are: * Thermal heating caused by differences in thermal expansion between the board and the component * Lead-free solder is more rigid and brittle than eutectic solder in simila
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