Electronics Forum: causes of dewetting via (Page 1 of 2)

Plugging of via through holes

Electronics Forum | Wed Jul 23 03:04:57 EDT 2008 | gfro

Hello, We are using a PCB with thickness 3.2mm 4 layer and lot of through hole via's of diameter 0.4mm. We specified our PCB vendor to do plugging. Now we have big problems, that after 1..4 weeks we measure a low resistance between track's/via's of

Plugging of via through holes

Electronics Forum | Wed Jul 23 08:18:29 EDT 2008 | davef

Q1. Is this a standard process for plugging? A1. Not as such. We checked both IPC-6012 and IPC-SM-840. Neither comments on plugging. So, your fabrication notes rule the day. Q2. Is this okay for such thick PCB's or is it mandatory to use a special pl

physical law of Dewetting

Electronics Forum | Thu Nov 01 05:30:06 EST 2001 | wbu

This is not about the physical laws but besides contamination, which will actually IMO cause NO WETTING, it is quite vital that the time-limit the flux is active is not exceeded during your reflow process. Depending on your paste/flux you will have a

physical law of Dewetting

Electronics Forum | Thu Nov 01 12:13:10 EST 2001 | jonathan

I guess this clarifies the defect more then looks at the process, but I�ll just through it out there for the sake of learning something new. If anyone would comment on this please feel free�. There are many different varieties of dewetting defects.

Via in the middle of a pad

Electronics Forum | Tue Jan 04 07:22:12 EST 2000 | Michael Selva

One of the boards has a via designed right in the middle of a pad for a 1206 cap, one side only. This causes the solder paste to run into the via during reflow. We run No-Clean paste. One alternative is to increase the aperture on the stencil for tha

piercing of test vias at ICT

Electronics Forum | Thu Nov 14 09:02:46 EST 2002 | MA/NY DDave

Hi Making contact has been one reported problem, so some testers put in higher force probes that then might cause problems. If fixturing is done correctly, the OSP is done correctly, and test follows close in time after soldering little problems s

Masking of PWBs prior to conformal coat

Electronics Forum | Fri Apr 21 17:46:29 EDT 2006 | SD

First of all, do not use kapton tape! It tends to cause a dewetting effect around the tape. A call to Humiseal will explain why. There's not really a blanket answer to your question.... Removing cured liquid mask can often result in a fillet ef

Re: BGA-Problems with adhesion of the solder balls

Electronics Forum | Wed Nov 01 09:01:55 EST 2000 | Thomas Ballhausen

Since your problem has been posted quite some time ago I am eager to know, if you have got any clue. One of my customers recently claimed our 313-PBGA causing problems, as one of its balls (randomly) is almost dewetting. So no evidence is found by x-

Re: Serial Numbering of PCB's (?)

Electronics Forum | Thu Feb 03 11:20:15 EST 2000 | John O'Brien

This is getting to be a more common practice, especially with the application of a 2-D bar code directly to the board (via laser, ink jet,etc.) Some really major companies are jumping on the bandwagon because it also allows treating each board as a l

Re: Storage life of Gold Finish Boards

Electronics Forum | Mon Jan 18 10:01:16 EST 1999 | John W

| | | | Folk's, | | | | | | | | I'm looking for information of how long you cna store a gold finish PCB before building it. I know there are problems with the gold disappearing into the underlying nickle over time / temperature etc but exactly how l

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