Electronics Forum | Wed Nov 01 09:01:55 EST 2000 | Thomas Ballhausen
Since your problem has been posted quite some time ago I am eager to know, if you have got any clue. One of my customers recently claimed our 313-PBGA causing problems, as one of its balls (randomly) is almost dewetting. So no evidence is found by x-
Electronics Forum | Tue Sep 14 08:46:31 EDT 2004 | scombs
I'm currently working for a OEM that has 700+ stencils in house and we received 30 to 40 stencil a month. We recently switched to a no clean process which is causing the stencil part numbers to disappear from the stencil frames due to the saponifier
Electronics Forum | Thu Nov 01 05:30:06 EST 2001 | wbu
This is not about the physical laws but besides contamination, which will actually IMO cause NO WETTING, it is quite vital that the time-limit the flux is active is not exceeded during your reflow process. Depending on your paste/flux you will have a
Electronics Forum | Tue Sep 12 07:59:03 EDT 2000 | Kevin Hussey
I suggest not to. You are also adding the flux of the paste that may cause you trouble in the long run. I suggest setting up a reclaim process with you paste vendor, or someone they reccomend.
Electronics Forum | Thu Nov 01 12:13:10 EST 2001 | jonathan
I guess this clarifies the defect more then looks at the process, but I�ll just through it out there for the sake of learning something new. If anyone would comment on this please feel free�. There are many different varieties of dewetting defects.
Electronics Forum | Thu Feb 11 14:36:42 EST 1999 | Evelyn York
Hey, has anybody experienced problems with solder balls falling off BGA's? I have not been able to identify a contaminant nor any physical problems that would cause this. On packages with 'good' adhesion I have not observed any intermetallic form
Electronics Forum | Thu May 28 15:54:45 EDT 2009 | elmerito
Hello, We have designed a 160ball bga substrate. Now we want to use the same substrate for the 145ball version of the product. All are the same, the package size, ball pitch, solder ball size only the number of balls will change. We will use a new s
Electronics Forum | Tue Jun 06 14:05:22 EDT 2000 | Jeff Sanchez
Ray, I don't know for sure what exact data Ceeris used to come up with their figures. Did they account for shipping? Was the rework done by expensive equipment? When I read your thre
Electronics Forum | Fri Feb 23 11:50:14 EST 2024 | emanuel
Unfortunately it is not possible to post pictures here. It looks the same as in these photos: https://yic-assm.com/wp-content/uploads/2019/06/dewetting-1.jpg https://res.cloudinary.com/engineering-com/image/upload/v1577777622/tips/20191216_174750_1_a
Electronics Forum | Thu Jun 23 11:56:51 EDT 2005 | wjxingggg
Hi, all. There is one 0.8mmX0.8mm QFN on almost of our PWBAs. But the quality report showed that we got bad solder quality for this component. My question is which elements are the root cause for this situation frequently? Thanks.
