Electronics Forum | Thu Apr 05 08:36:35 EDT 2001 | jmlasserre
use a solder join temperature of 200/210� whatever the pcb used (tin lead coated or osp or gold fash). 2nd ==> to adapt the temerature to the pcb used: - Reflow (200-210�) for tin lead coated pcb's (in this case we have just to reflow the solder
Electronics Forum | Mon Jan 26 15:09:59 EST 2009 | leemeyer
IPC 7530 - Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
Electronics Forum | Tue Feb 03 14:19:29 EST 2009 | grics
I would agree if you have a board to setup the process. But sometimes this doesn't work... If for some reason if the customers AVL has a Lead Free BGA and I am running Leaded paste (yes this really happens!), you will need to run hotter to get your
Electronics Forum | Mon Jan 26 11:58:06 EST 2009 | ghcarnu
Hi there, where can I find some hints about placing the temperature sensors on the pcb when determining the reflow profile? I'm interested especially in the case of a pcb having BGA's. Thanks for your answers ! gheorghe
Electronics Forum | Thu Jun 08 04:31:24 EDT 2006 | vasily
Hi First I think you have to analize your PCB design. Heavy weight components should be gathered on one side of PCB. As I think, if you want to reflow both sides simultaneously there might be a problem. A chance that large components will drop off
Electronics Forum | Fri Nov 25 05:16:44 EST 2016 | slavek
Hello, I want to ask on suitable temperature profile for PCBs with ENIG final surface finish. I know that it is complex question with many unknowns. When the PCB will be standard 1,5 mm 35/35 Cu and the amount of components will have any influence o
Electronics Forum | Wed May 04 10:42:55 EDT 2005 | nice90
Handling a PCB 1. Check your ESD slippers and ESD Strap first before entering the SMT production line 2. A PCB manufactred over 90 days must be stored first on the baking Oven before Production 3. Temperature on the Baking oven must be 125plus and m
Electronics Forum | Mon Jul 01 09:33:08 EDT 2019 | dbuschel
if you can't change the PCB materials or design at this point, you might be able to reduce it somewhat through the use of fixtures or edge stiffeners. Unless it is a particularly thick board, I don't think the reflow profile would be the issue. The t
Electronics Forum | Mon May 13 23:44:26 EDT 2019 | dami0629
if use tray cannot solve the problem, you can change from the design 1）Reduce the effect of temperature on PCB 2) PCB USE HIGH TG 3) BOARD THICKNESS TOO THIN 4) MODIFY THE BOARD SIZE 5) Reduce the V-CUT depth.
Electronics Forum | Mon May 24 16:45:44 EDT 2004 | Bob
BTU as well as most oven manufactuers have great products. If they fit what your looking for and can give you good support(preferably local) then you should not really see any quality problems with their products. With the oven max temperature of 300
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