Electronics Forum | Mon Aug 13 10:00:18 EDT 2007 | ed_faranda
Might want to check to see if the weight of your part has increased. If it has increased, you may not have enough surface tension to hold the part on the board. I am assuming you already checked that the component isn't getting hit by something in
Electronics Forum | Tue Feb 16 13:57:50 EST 1999 | Ron Beasley
| | I have a recent design (1 component side only) that calls for 2 surface mounted antenna's (brass plated) to be mounted on a PCB. The problem arises when the PCB is 18x11.25 and has 15 to 20 PCB's in the pallet (IE weight, fixturing to hold the a
Electronics Forum | Mon Sep 13 04:11:27 EDT 1999 | Earl Moon
| | hello | | | | having a problem with one customers bare boards not matching my stencil apertures. i design stencils based on gerber data and reduce up to 15% on some pads. do some board houses reduce pads after receiving gerber data???why would
Electronics Forum | Sun Sep 12 10:08:55 EDT 1999 | Earl Moon
| hello | | having a problem with one customers bare boards not matching my stencil apertures. i design stencils based on gerber data and reduce up to 15% on some pads. do some board houses reduce pads after receiving gerber data???why would they d
Electronics Forum | Tue Mar 09 07:51:12 EST 2004 | Bryan
Hello everyone: 1.I use Kester R244 63/37 solder paste. 2.Stencil thickness 6 mil. 3.Springdale Chipset. 4.PCB finish:HASL 5.Profile:Peak temp.:210~220C,time above 183C:60~90 seconds,time between 150~183C 60~90 seconds. 6.Reflow oven:Heller 1800 Voi
Electronics Forum | Tue Sep 26 14:24:49 EDT 2023 | dimamalin
Every year, an engineer from the local service center comes to us and performs the necessary maintenance and calibration.
Electronics Forum | Thu May 24 16:45:57 EDT 2001 | kmorris
Hi All: We�ve got a problem here with opens on bottom side wave soldered SOT23s. Based on past experience and review of the SMTnet archives, I feel that our main problem is pad size. We have the same size pads for bottom side SOT23s as we have for
Electronics Forum | Thu Jun 09 13:30:34 EDT 2005 | PWH
I would suggest 7mm thick "Durostone" as a carrier material. Cut lip/pocket for PCB so it is 0.05" thinner than thickness of PCB. Allow 0.010" gap on all sides of PCB. Machine lip to width between 0.050" and 0.100" to support under perimeter sides
Electronics Forum | Mon Jun 24 13:01:24 EDT 2013 | quaker332007
Can anyone help me with the center support on this oven? The support is rising up to high and causing the board to rock during reflow. Is the away to lower the center support?
Electronics Forum | Thu Oct 16 12:35:03 EDT 2014 | upguy
We have tpsys 1.5.18 on our TP9-UFP. We are attempting to run "Optical Centering Calibration". Following the instructions in the manual, we have centered the cross hairs on the camera frame, loaded a "base" board then the L-19-447 calibration boar
