Electronics Forum | Tue Aug 07 21:17:24 EDT 2001 | davef
This provides LT 3 misses /1M hits. * Probe all points on one side of the board. Bonus => This lower fixture cost. * Test pads and vias: GT 25 thou from other land traces. * Small [LT 5 ohm] resistor measurements: Use two pads at each end and do 4-
Electronics Forum | Sat Jun 12 16:33:52 EDT 1999 | JohnW
| | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from manuf
Electronics Forum | Wed Apr 02 12:50:01 EST 2003 | rdr
Does anyone know of any standards that deal with the physical location of BGAs on a PCBA? I am looking for something that states to not put BGAs in the center Axis of assemblies for bow and twist reasons. We have always informed customers to locate
Electronics Forum | Fri Jun 10 12:05:54 EDT 2005 | jdumont
Hi all, we are just getting into using local fiducials for BGAs. My question is, in addition to having to be on the same diagonal (opposing corners) do the fiducials have to be the exact same distance from the center of the part? I always thought yes
Electronics Forum | Tue Sep 18 12:47:33 EDT 2012 | mbnetto
Hi, Regarding to thermocouple placement, you should use a precision thin drill. Drill through the bottom of the board to the top as follows: One hole in the center of the part, preferably into one of the center balls, if available. One hole into the
Electronics Forum | Fri Nov 08 11:10:36 EST 2013 | rgduval
I'm not completely sure what you're asking, but, I can say that I've placed these parts with MyData's and Philips machines. Pick in the center of the part, and place in the center of the outline, and the terminals should line up with the pads on the
Electronics Forum | Fri Jun 28 11:25:01 EDT 2002 | dason_c
You need to check your pot temperature and the board surface temperature. You know the melting point of the 63/37 at 183C. If your top side surface temperature is above this point and second reflow may happen. Also, the board will warp and may cau
Electronics Forum | Wed Jun 02 19:03:11 EDT 2004 | black5629
My board is in the center, it appears that it would read the stencil but not the board. " Board Model NOT found".I am open for any input.
Electronics Forum | Fri Dec 17 16:23:22 EST 1999 | Mike Naddra
Hello Henry, Tombstoning is caused (In most cases) by a force imbalance on either side of the component. As the solder becomes liquidous the surface tension of the liquid will pull the component to the center of the liquidous area. To solve the probl
Electronics Forum | Thu Jul 26 09:22:20 EDT 2001 | nwyatt
We are currently testing 0201s. We are using T3 paste, and it is working fine. You will need specialized feeders, test components, and test boards. Also depends what machines you are using - some are not capable of placing 0201 components. My s
