Electronics Forum | Mon Jul 16 21:39:40 EDT 2001 | davef
The method you suggest is about the only way to �clean-up� this terrible situation. Realistically, this is a "memory" type condition induced by design, build symmetry, "cross ply construction", excessive cool down rates during lamination or reflow a
Electronics Forum | Fri Jun 29 23:10:02 EDT 2001 | Danial
Thanx for the reply guys!! The problem happened on only one PBGA, the balls are eutectic and the paste volume height is at 5.96 mil min. The stencil opening has been increased to 30 mil which initially was 20 mil. You guys are right!! One probable
Electronics Forum | Mon Jun 29 13:38:20 EDT 1998 | Russ Miculich
| looking for help with fine-pitch printing for what would be the best settings for printing speed, squeegee pressure, seperation speed. | thanks for you time Brian: As Justin says - the issues are many. However, a good start would be to run at 0.75
Electronics Forum | Tue Nov 27 10:16:07 EST 2001 | davef
Oooo, I get it. We do that trick on the wave solder side of boards. On the bare board, during design / layout, the basic shape of the jumper is a 125 thou disc of copper [that of course is eventually covered with whatever solderability preservative
Electronics Forum | Tue Mar 25 08:35:49 EST 2003 | pjc
AccuFlex is the replacement for UltraPrint 1500. UP1500 is going obsolete. AccuFlex was desgigned for fast setup and changeovers and takes some tasks away from the operator. The UltraPrint 2000 was designed for high production, even though many users
Electronics Forum | Fri Jun 10 18:44:28 EDT 2005 | Frank
This depends on how the software of your particular machine was written (designed) to handle local fids. Most machines do not have a requirement about the position of the local fids. The purpose of local fids are the same as global fids. All the p
Electronics Forum | Tue Dec 18 10:08:16 EST 2007 | bbarton
Drill a hole through the board (or the BGA) and set a thermocouple into the center of the device (in the X Y and Z dimensions) and run your profiler through the oven until you get the temp you need in the center of the BGA. Attach a second thermocoup
Electronics Forum | Wed Feb 13 11:23:14 EST 2019 | aldrich17
We have several issues with components placing properly onto designated leads without having to offset our boards fiducials before population. For several of our boards, we cannot set our fiducials "dead center" but rather offset them in various dir
Electronics Forum | Thu Sep 02 11:47:55 EDT 1999 | ScottM
| For space contracts we have to mount chip capacitors/ resistors etc 0.1 to 0.4 mm from the pad height. | | This is to compenstae for the CTE differential in the substrate/component and also to ensure cleanliness. | | Does anyone have any new idea
Electronics Forum | Thu May 11 15:07:42 EDT 2000 | Finepitch Services
I assume your oven has a "board width" setting for every board and the conveyor width is automatically adjusted as soon as you select the profile/recipe... For the double sided reflow boards, I would set the width 1 inch (or another rounded amount)