Electronics Forum: centered 2.printing (Page 1 of 1)

Reflowing a PowerPak SO-8

Electronics Forum | Thu Nov 06 07:54:50 EST 2003 | davef

First, skewing is a perfectly acceptable condition, providing the amount of skewing is not excessive. A-610 provides guidance. Second, this part is a land grid device. Land grid devices [ie, BCC�, LGA, QFN, MicroLeadFrame�, etc] are essentially BGA

BCC Technology --- Placement, Rework, Reflow

Electronics Forum | Mon Mar 25 21:50:10 EST 2002 | davef

Some of this was copped from Fred. There are numerous package types that now fall under the rubric of land grid array [LGA]. Land grid devices [ie, Bumped Chip Carrier� [BCC], LGA, Quad Flat-pack No-lead [QFN], MicroLeadFrame�, etc] are essentially

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