Electronics Forum | Thu Jun 17 10:37:42 EDT 1999 | Brian Wycoff
| | | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from
Electronics Forum | Thu Jun 17 11:18:03 EDT 1999 | Ian Clelland
| | | | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down fr
Electronics Forum | Mon Jun 07 22:30:28 EDT 1999 | Dave F
| | | I was wondering what measurements are used to define pitch? | | | | | Frank: John's correct with the most common definition, but there can be others, depending on your perspective. TTYL Dave F | | | | Pitch. The center-to-center spacing b
Electronics Forum | Mon Aug 31 22:30:09 EDT 1998 | Kelly Morris
We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. Our pad design is .020" diameter pads with .025" solder resist diameter. The center
Electronics Forum | Tue Sep 01 19:16:51 EDT 1998 | Kallol Chakraborty
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
Electronics Forum | Tue Sep 01 02:50:40 EDT 1998 | karlin
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
Electronics Forum | Mon May 06 02:30:25 EDT 2002 | dszeto
We have continual vision process error 1CB02003 on narrow view camera during nozzle centering measurement. The wide view camera works properly. So far we have done the following things to rectify the problem but the problem still exists: 1. Replac
Electronics Forum | Mon Apr 21 17:13:04 EDT 2003 | jonfox
I remember from my days of machine setups that these packages' CAD data is actually off center from where the placement needs to be. Usually CAD center comes up with the parts more to the large collector/ground pad so the the smaller gull wing leads
Electronics Forum | Thu Oct 30 00:12:13 EST 2003 | Grant Petty
Hi, Another option we have used here in house is to remove the unwanted BGA balls with solder wick, and then to manually place them on the PCB foot print. This eliminates the pick and place machine's optical centering freaking out because the balls
Electronics Forum | Thu Feb 05 14:33:32 EST 2004 | paul_bmc
I am in the process of programming my first PCB on the CS-400E machine and am having problems. I am too impatient to wait for the manuals on order so I thought I might see if someone out there might have some suggestions. I have done some research o
