Electronics Forum | Mon Feb 18 08:30:28 EST 2002 | jax
Wolfgang, Billboarding is kinda like a tombstone. The part is just sitting on it's side instead of on it's end. There should be plenty of info on this in the archives under billboard and tombstone. Most likely cause is off center placement and ov
Electronics Forum | Mon Mar 18 14:55:59 EST 2002 | John Z.
I suggest speaking with the people over at Circuit Technology Center. If your rework requirements are low, it may be cost effective to out source. http://www.circuittechctr.com
Electronics Forum | Wed May 29 14:24:51 EDT 2002 | caldon
Stick with round aperatures they work fine. If you are successfully processing fine pitch QFP's then switching to BGA's should be no problem. Profiling is a little tricky, a thermal couple should be mounted at the under/ center of the component. cal
Electronics Forum | Fri Jun 28 11:25:01 EDT 2002 | dason_c
You need to check your pot temperature and the board surface temperature. You know the melting point of the 63/37 at 183C. If your top side surface temperature is above this point and second reflow may happen. Also, the board will warp and may cau
Electronics Forum | Thu Aug 01 04:12:39 EDT 2002 | jk
Anyone have experience with BGA mount on via hole in pad. I'm encountering about 1 to 2% yield loss due to BGA solder short. This is an entek PCB. The BGA pad size is 32 mil, and the via hole (dia. 10 mil) is at the center of the pad. Any professiona
Electronics Forum | Tue Aug 13 16:59:17 EDT 2002 | stefwitt
have you tried this one? www.smtnet.com/career_center/dsp_view_job.cfm?listing_id=1591 good luck!
Electronics Forum | Thu Aug 22 02:18:09 EDT 2002 | mjabure
Specify the nozzle size as 1.4 in both the nozzle allocation table and the PD, the nozzles will still pass center test as the size variation is still within tolerence.
Electronics Forum | Mon Nov 18 16:16:59 EST 2002 | Dick Van Belzen
We are trying to understand if there are proceeding or whitepapers which document the cost differential of the electroforming process for stencil vs. other methods. And what the related benefits are. Our center for advanced technology is trying to
Electronics Forum | Sun Mar 16 20:46:18 EST 2003 | MA/NY DDave
Hi Good, that is one of the things I see some have done. With paste too thick these little components float too much off, rather than centering. YiEng, MA/NY DDave
Electronics Forum | Thu Apr 10 19:19:01 EDT 2003 | stevemoore
Are you gluing the parts to the board? We had a similar situation where the glue beneath the component would add a 'fulcrum' point to the center of the device and when the board flexed the part would fracture.
