Electronics Forum | Fri Sep 01 03:06:20 EDT 2000 | Adelina Baggayan
Hi!, Can anyone help me with problems with Solder voids after reflow curing on D2PAK heatsinks? I would like to remove the gas from the solder paste; can centrifuge help?How many minutes should a solder paste in a tube be processed in a softener? Ho
Electronics Forum | Tue May 11 08:35:26 EDT 2010 | cyber_wolf
If you see flux separation mix the paste with a spatula before you transfer it. There is no need for a centrifugal mixer.
Electronics Forum | Fri Mar 12 01:51:45 EST 2021 | proy
Resolved, the centrifugal pump seal (5/8th shaft) had failed and we were able to get a goulds replacement, back up and running in 2 days. Just FYI for anyone with similar problem in the future
Electronics Forum | Tue May 11 08:21:16 EDT 2010 | nrw
Hello, I am in the process of setting up processes for a low volume SMT line for internal prototype production, where a 500g jar of solder paste would last weeks. Our distributors only seem to want to supply 500g jars (anything else is significantl
Electronics Forum | Tue May 11 15:56:10 EDT 2010 | davef
First, you mix the paste in the jar with the centrifugal thing-a-ma-jig. Then what? So, how are you going to get the paste from the jar into the syringe [cartridge], anyhow? Are you going to use an Atlas Tool? How are you going to de-air the syri
Electronics Forum | Wed Sep 05 17:37:56 EDT 2001 | seand
Hello Jeff, If you have components on your board be careful of how low the frequency is that you will be applying to your board. Ultrasonics are great for cleaning stencils and bare boards at around 40kHz. These frequencies (and Lower)may however
Electronics Forum | Wed May 22 08:43:40 EDT 2002 | pjc
I have experience cleaning NC for military boards. The reason for cleaning the NC is due to conformal coating requirements. Zestron Vigon A200 and Atron AC 100, as well as Petroferm Hydrex DX have both been effective at cleaning Alpha UP78 NC paste.
Electronics Forum | Fri Feb 23 09:35:36 EST 2024 | emanuel
We have the standard profile as a template made according to the solder paste specs. For some boards we measure the result at 2 points, on the board itself and on top of a sensitive SOT263 module and adjust accordingly. The solder paste is well kept,
Electronics Forum | Sat Oct 27 12:01:32 EDT 2001 | Stefan Witte
Most of the machine suppliers Fuji, Siemens, Universal and Panasonic did regret that they were building glue machines. Applying adhesive compared to placing a component looks so simple, but it is not and the defect rate is higher than placing 1206 c
Electronics Forum | Sat Jun 12 00:34:00 EDT 2004 | kanwal324
Hi ! The main problem being faced currently is formation of solder balls - to be precise, these are micro solder beads generally found attached with bodies of SOTs, Chip Caps, Chip Resistors, between pins of SOICs (50 mil) - lying on PCB surface,
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