Electronics Forum | Thu Feb 18 21:51:48 EST 1999 | Dave F
| What are some suggested standards/speced requirements and procedures for removal/addition of missing balls on laminate and ceramic based bga packages and quality requirements for same. | 3: I'm unaware of such documentation, but then again documen
Electronics Forum | Thu Oct 04 00:05:25 EDT 2018 | gaintstar
Flason SMT chip mounter Reflow Ovens: http://www.flason-smt.com/product/PCB-assembly-line-equipment-SMT-spare-parts-Dek-Motor-188962.html http://www.flason-smt.com/product/PCB-Conveyor-for-LED-Production-Line-SMT-Assembly-Line.html http://www.flason-
| 1 |
winsouce.jpg)
