Electronics Forum: cfm (Page 1647 of 7901)

Immersion Silver

Electronics Forum | Wed Nov 06 13:01:54 EST 2002 | cvrgirl

Hi, Has anyone experience BGA caps/plugs popped off after assembly on a double sided board? Only the caps on the primary side popped off and exposing copper. thanks! Michelle

Simulation of Placement Cpk on Paste

Electronics Forum | Thu Nov 07 06:10:13 EST 2002 | stefwitt

I used once flux cream on a glass plate for a customer application, which should simulate almost the same cohesion than solder paste.

type 3 vs type 4 paste

Electronics Forum | Fri Nov 08 17:10:04 EST 2002 | rspoerri

Is that square inscribed or circumscribed with respect to the pad? It sounds like you're saying circumscribed (overprint) given the volume comment. Wanted to confirm though. Kim

type 3 vs type 4 paste

Electronics Forum | Fri Nov 08 17:20:52 EST 2002 | davef

You need to get as much paste on the board as you can get. A BIG opening gives: * Better release. * More paste. You may be able to cheat further by rotating the square so that it is on the diagonal.

BGA placement on PGA

Electronics Forum | Thu Nov 07 14:30:38 EST 2002 | Debi Musante

We have been presented with the task of placing a BGA on top of a PGA. The previous process choice was to apply paste directly on the BGA (which failed functional testing) We are considering applying tacky flux (only) on BGA, since this is our first

BGA placement on PGA

Electronics Forum | Thu Nov 07 16:42:28 EST 2002 | jonfox

Just a link to a former customer of mine. http://www.adapter-tech.com/ They have adaptive sockets for placement of BGA onto PGA designed PWB.

Black pad analisys

Electronics Forum | Thu Nov 07 21:50:58 EST 2002 | Juan C. Ruiz

I work in a plant located in Monterrey Mexico, I would like to know where I can sent some boards to be analized since we have the suspect to have a black pad problem with the boards. Any Idea?

Solder printing issues

Electronics Forum | Fri Nov 08 14:58:59 EST 2002 | davef

On the board support issue: DEK and Ovation Products make board support things to get at the issue you describe. Ovation hosted an On-Board Forum on SMTnet a while ago.

Solder printing issues

Electronics Forum | Wed Nov 13 23:50:23 EST 2002 | iman

we changed our top/bottom clamping system in the Printer, to a side-edge clamping system. This removed the higher paste issue similar to your thread.

Solder printing issues

Electronics Forum | Sat Nov 23 11:34:52 EST 2002 | mark

There is some superb tooling offered by a company called Transiton Automation, http://www.board-lok.com. There are some different choices, full molded tooing ... a service,... and re-usable fine grid pin array tooling.


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