Electronics Forum | Wed Jan 05 12:48:44 EST 2000 | Dave F
Millerin: You are generally correct about plugging and over plating vias, but in Michaels case, the via is blind. Plugging would trap air between the bottom of the via and the plug material, causing an air pocket. When heated to soldering temperat
Electronics Forum | Mon Jan 10 10:02:57 EST 2000 | Istv�n Dominik
We had the same problems. Certainly the best solution to redesign the boards. Otherwise the holes must be plugged. We tried many solutions (more paste, printing twice etc.) but the result was almost the same. Finally we printed solderpaste only on th
Electronics Forum | Mon Jan 10 19:13:46 EST 2000 | TNT
HELLO MIKE, THE PROBLEM WITH THE VIA BEING IN THE MIDDLE OF THE PAD CAN BE HANDLED. IF YOU ARE HAVING PROBLEMS WITH SOLDER FLOWING THROUGH AT REFLOW YOU MIGHT WANT TO CHECK YOUR VACUUM AT YOU SCREEN PRINTER. SOMETIMES THE VACUUM THAT HOLDS THE PCB
Electronics Forum | Mon Jan 03 14:00:06 EST 2000 | John Anderson
Has anyone had luck with 0201 cap board design, solder printing and reflow? IPC-SM-782 does not provide much help. I am particularly interested in attach pad design, stencil aperture design and thickness, solder paste (mesh, metal content, etc.), and
Electronics Forum | Tue Jan 04 11:25:34 EST 2000 | Brian E. Steelglove
John, I work for Panasonic Create and I just got back from Japan where we sat through a presentation on pad layout and stencil layout on the 0201. Please give me your fax number and I will send it right over. Sorry I do not have it on disk. Bria
Electronics Forum | Wed Jan 05 06:55:48 EST 2000 | Mark Alder
Please go into s.m.t.net archives 19/2/1999 and have alook at the suggestions I received.I have found them to be fairly accurate and work pretty good.Lazer cut stencils also made a significant improvement.The adhesive I used was AMICON D125F3 from Em
Electronics Forum | Mon Jan 03 03:45:16 EST 2000 | HC Choi
Dear all, Ever thought about retrofitting your ICT testers to make them truly inline? We're doing some serious re-engineering and everything's on the list. Anyone got any experience (good and bad) to share? HC BTW, we'll KEEP the ICT guy, but he'
Electronics Forum | Thu Dec 30 21:51:47 EST 1999 | Dave F
Jason, if you're considering: * "Stacking" components, it's a bad idea because you're reducing the surface area of the lower component, which is required for heat (power) dissipation. * Multiple components side-by-side or end-to-end, it acceptable
Electronics Forum | Thu Dec 30 10:56:58 EST 1999 | Marlies Hanf
Hi. Is there a difference between "centering a component" and "aligning a component"? I've noticed that "centering" is used much more often but I don't see any difference between "centering" and "alinging". Am I right?? As far as component feeders
Electronics Forum | Thu Dec 30 12:17:19 EST 1999 | JAX
Marlies, The terms are one in the same but are used according to how you descibe the situation; i.e. centering refers to adjusting the part where as aligning normally deals with adjusting the vision. NOT THAT THIS IS A RULE. ( different strokes...
