Electronics Forum | Thu Aug 19 05:42:01 EDT 1999 | Brian
| We have developed a new process for removing moisture from surface mount devices. We have one site where PCB laminate drying has been reduced to 1.5 hours. A standard oven took 4 hours to do the job. I am looking for a firm who does large scale boa
Electronics Forum | Wed Aug 18 16:26:21 EDT 1999 | Tony
Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. This is what I did. Created a removal profile, I had a board
Electronics Forum | Wed Sep 01 14:01:33 EDT 1999 | Dave F
| | I'd also like to chime in here to keep the thread alive in hopes that someone is familiar with the CEERIS studies. I have seen other companies, such as Frost & Sullivan and Technology Forecasters do similar work for much less (although I don't
Electronics Forum | Wed Aug 18 15:56:20 EDT 1999 | david dougherty
Hadco offers a technology of building in a "buried" capacitance layer (& other embedded passives) in organic PWBs (FR4 for example). see http://www.hadco.com/prod03.htm and a design manual is posted here: http://www.hadco.com/pdfs/bcguide.pdf I am c
Electronics Forum | Fri Aug 20 10:44:40 EDT 1999 | k.t
| | Is there process by which one can do a double sided reflow (SMT on both sides) in one pass through the oven? | | | Probably not. I have heard people talk of it but never see it done and I wouldn't recommend it. | | Good luck | | Yes, it is d
Electronics Forum | Tue Aug 17 00:42:40 EDT 1999 | ScottM
| Does any one have any idea which is usualy more expensive, to get components on Reels or in Trays ( I mean large components ofcourse). | What is price diffrence percentage ? | | practicaly, is one method is prefered to the other? | | Thanks alot
Electronics Forum | Mon Aug 16 16:46:47 EDT 1999 | Mark Thaler
| | We have a design on which there is an ASIC that will not be produced anymore in the future. As we want to make this design over the next 10 years we are evaluating the possibility to buy the necessary ASICs for the next 10 years. This will give u
Electronics Forum | Tue Aug 17 13:39:30 EDT 1999 | Brian
| We have a design on which there is an ASIC that will not be produced anymore in the future. As we want to make this design over the next 10 years we are evaluating the possibility to buy the necessary ASICs for the next 10 years. This will give us
Electronics Forum | Mon Aug 23 11:36:22 EDT 1999 | Phil B
| | We have a design on which there is an ASIC that will not be produced anymore in the future. As we want to make this design over the next 10 years we are evaluating the possibility to buy the necessary ASICs for the next 10 years. This will give u
Electronics Forum | Mon Aug 16 09:50:20 EDT 1999 | Earl Moon
| Hello reflow experts, | | I just wanted to know the effects of N2 and O2 on reflow furnace to the solder ball apperances. | | thanks in advance.... | | ...Omat | | Not really that much with eutectic balls and solder pasted pads and the reflow
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