Electronics Forum | Sat Aug 26 03:18:15 EDT 2017 | ausplex
Mid-production our KE-730 halted and gave us a “SUB CPU1:BUS ERROR” message on the video monitor. Then we got on the same monitor a detailed error message with address and byte information (unfortunately I didn’t copy the details). Now when we boot
Electronics Forum | Wed Aug 30 13:26:29 EDT 2017 | fuji_user_2014
Hello Gurus, I'm looking for information on FOD generated by routers, more specifically a vacuum equipped Cencorp 1000BR. I want to ensure that this machine can route a populated panel without needing a wash afterwards in order to meet IPC CL3 sta
Electronics Forum | Thu Aug 31 16:16:44 EDT 2017 | tschoen
Hello, I have to learn how to program an old MyData (M9) pick and place machine that's been sitting in the company's basement for several years. Unfortunately, I have very little documentation. The machine runs, and there are some programs stored
Electronics Forum | Tue Sep 05 14:40:08 EDT 2017 | rgduval
We emailed off forum about this...and I'm wondering how things are progressing. As I noted in email, our issue was the nozzle change was resulting in too many nozzles being out of the same vacuum channel on the tool box. I can't remember how it was
Electronics Forum | Fri Sep 01 16:44:41 EDT 2017 | dgaddisatprimepower
I've been struggling trying to get our TP9 machine to place 8-dfn package parts. One of our primary assembly contracts uses a SOIC8 but the pad design accommodates an alternate 8-DFN part and sometimes we have to go to our alternate part due to lead
Electronics Forum | Tue Sep 05 15:22:37 EDT 2017 | dgaddisatprimepower
Thanks for the replies. I ended up finding the issue this morning while digging through the operators manaual trying to back track any issues in the package. We ended up finding that somewhere along the way either, however unlikely, the body size had
Electronics Forum | Fri Sep 08 21:49:24 EDT 2017 | sbar5781
Hello, I have a few PCB boards i am trying to be manufactured that are miniaturized medical devices. Thus they require IPC Class 3 Specs. However as miniature devices they have limited space, including a 0.4mm pitch BGA socket, which currently has
Electronics Forum | Wed Sep 20 16:15:53 EDT 2017 | davef
Some requirements to consider are: * Humidity and temperature controlled according to J-STD-001 * Electro-static discharge (ESD) control program according to ANSI/ESD-S-20.20. * Soldering technicians are trained and certified according to J-STD-0
Electronics Forum | Wed Oct 18 09:32:05 EDT 2017 | alexeis
Hi, Pick and Place file is included in CAD file. CAD file contains full information about a board including internal layers, silk, PAD/Component structure, and more. You can use Pick and Place (PnP) file on preparing SMT Programs. In case of small
Electronics Forum | Sun Nov 26 01:50:32 EST 2017 | alexeis
Hi Ivan, Our solution works with 3 type of data with XY: 1. CAD - the best choice but, as you mention, I isn't available for all products. From our experience, it is available in 30%-50% of products. 2. IPC - This file available in 80%-90% of produc