Electronics Forum | Fri Aug 24 02:40:52 EDT 2018 | bukas
first check fuses in Y1 case. thats where EuroSYS cards are, and message you get tells you that cards can not communicate with main processing board in Y3 case via RS485. after that check cables and connectors. there are 4 EuroSYS cards in Y1 case, t
Electronics Forum | Wed Aug 29 05:30:30 EDT 2018 | teresat2
I guess these boards only used Fly test. Flying needle test is one of the methods to check the electrical function of PCB (short circuit test). The flight test machine is a system for testing PCB in a manufacturing environment. Instead of using the
Electronics Forum | Wed Sep 05 06:34:08 EDT 2018 | oriolsancheza
Hi Rob, Thanks for your fast response. In fact, after a better look to driver boards, it has leaking SMD Electrolityc caps. Unfortunately after replacing them in 3 units, one of them gives 90% of times, ALARM4 led ON. Looks like a comunication pro
Electronics Forum | Sun Sep 01 22:02:58 EDT 2019 | sarason
Have you got a circuit diagram for your driver board? If not measure your driver into a resistive load and look for differences in current flow voltage drops under load dried out caps. Dead current measuring circuits etc. If you see an IC, look it up
Electronics Forum | Thu Sep 06 11:24:56 EDT 2018 | davef
pdf "BGA Stencil design guideline for avoid bridge" As you would expect, Google found 40,000+ results in less than a second One of my favorites was Power Point Presentation by Greg Smith [gsmithATfctassembly.com] at FCT Assembly: "Improve SMT Assem
Electronics Forum | Fri Sep 07 11:46:29 EDT 2018 | dleeper
Air gap on the PCB is determined the pad spacing which in turn is governed by the component. As long as the PCB designer is following the typical BGA layout best practices; i.e no open via in pad, non-solder mask defined pads, solder mask covered tra
Electronics Forum | Wed Sep 12 00:18:19 EDT 2018 | aqueous
Here's a link to an article regarding foam mitigation techniques. It my be helpful. There are many causes of foam. Water alone does not foam. Flux, solubilized in to the water can produce foam. Defluxing additives contain defaming agents which should
Electronics Forum | Fri Sep 14 19:55:06 EDT 2018 | amartineck
I have a GSM1 that when try to zero it, it stops with the "Timeout waiting for spindle up" message. To get thsi up and running, I have set all my machine settings to default and had to reselect the head from a C4 1 head to the flex head. I initially
Electronics Forum | Wed Sep 19 10:34:44 EDT 2018 | sarason
Now I have to guess and make a few assumptions. Without looking at the back side of the board my guess is you have some 400-100V diode bridges before the resistor ,zener and the FET . The FET is a 500V 0.85 Rdson NFET. All of this suggests a chopper
Electronics Forum | Thu Sep 20 03:31:42 EDT 2018 | minhhaioh34
Hi all, I need some pro help me with issue bubbles after coating. some information for some pro: Machine: Asymtek Chemical: Achime AVR80 Oven: IA 4 zoon4 ( setting 100 100 90 80 conveyor speed: 0.6 m/min). I had happened before and after the oven. W
