Electronics Forum | Sat Sep 20 11:24:27 EDT 2003 | Gabriele
Few questions: - wich type of C-CGA ? (CAST or CLASP column to ceramic attach) - column pitch ? - column count ? - capped (with lid) ? or capless (c4 die on top)? - PCB board zize and thickness ? - volume of solder paste ? - Clean or not Clean so
Electronics Forum | Tue Feb 27 12:43:43 EST 2001 | gsmguru
I've used an on-axis camera lighting for other components with a good deal of success. (But not for CGA's in particular) I would think it should work pretty well for a CGA application. I've done some pretty odd looking parts with this type of lightin
Electronics Forum | Fri Sep 19 11:49:54 EDT 2003 | chrissieneale
OK, so is anyone qualifying CGA's yet? Our first batch of CGA qualification is not going too well. We stuck with the teardrop shaped pad but the solder fillet is not as big as expected. What size pads is anyone using, i'm getting conflicting informat
Electronics Forum | Mon Sep 22 15:13:59 EDT 2003 | russ
Cool!!!! I'll have to remember that one. Russ
Electronics Forum | Tue May 28 21:10:15 EDT 2019 | slthomas
Not according to the data sheet for the CGA parts, and ours is an 0603, I think.
Electronics Forum | Sat Sep 20 11:44:39 EDT 2003 | Gabriele
Few questions: - wich type of C-CGA ? (CAST or CLASP column to ceramic attach) - column pitch ? - column count ? - capped (with lid) ? or capless (c4 die on top)? - PCB board zize and thickness ? - PCB copper finisch ? (OSP,HASL, ENIG, etc) - v
Electronics Forum | Tue May 28 18:23:15 EDT 2019 | slthomas
TDK makes the CGA series "soft termination" caps. The p/n we use is CGA3E3X7S1A225K080AE, which will get you in the ball park for datasheets. We have moved to this to counter some variability in a heat staking machine (that we have yet to work out
Electronics Forum | Mon Feb 26 14:06:09 EST 2001 | marting
We have just started to be involved with collumn grid array devices and are currently placing them by Universal GSM machinery. We have been advised by Universal that they supply "On Axis" cameras designed for visioning CGA devices, however the cost i
Electronics Forum | Fri Sep 19 12:55:33 EDT 2003 | russ
We usually use a pad that is the same size as the ball. And use a stencil thickness of 7+ mils. Why the teardrop? Russ
Electronics Forum | Mon Sep 22 02:15:09 EDT 2003 | chrissieneale
We were having void problems with heat transfer down the via's (24 layer boards, shed loads of planes). So we drew the via away from the centre into a teardrop pad. Void's gone!
