Electronics Forum | Fri Sep 08 10:23:38 EDT 2006 | slthomas
By profile (profile has not been changed) are you referring to the oven zone settings or the actual charted profile of a trip through the oven as recorded by a thermal profiler? Some ovens will continue to function without warning as long as temps
Electronics Forum | Fri Sep 08 11:32:19 EDT 2006 | darburch
Solder joint too shiny, clock wrong color, she's got my chair, radio too loud, can't hear the radio, I'm too hot she's too cold change the A/C.Kindergarten wasn't this petty.OH, wait this is a heath and safety issue, I need the day off with pay. Why
Electronics Forum | Fri Sep 22 15:00:37 EDT 2006 | Bill
Oh, please, give me a freaking break!!!!! Can't you keep politics out of this forum. Not the Brit. What they use in Turkey and Tunisia- yeah, those two technical hot beds, they know electronics like I know making a carpet. Syria- you should be next f
Electronics Forum | Mon Sep 25 09:42:51 EDT 2006 | slthomas
It sounds like it's just failing the laser align step. Try changing the align type for the part to "2" and see if it places it. If it's failing the laser align and you have valid part dimensions I can't help much but you might consider opening up th
Electronics Forum | Mon Oct 02 19:04:53 EDT 2006 | DC
We had a issue on the SBGA and found stress built up at the corner of the SBGA after cool down to room temperature. It is confirmed by the warpage analysis. I expected that the stress caused by the heat spreader and the epoxy to the copper frame. O
Electronics Forum | Wed Oct 04 14:14:49 EDT 2006 | russ
Change mfgrs of paste OR better yet use pbfree paste, If you are collapsing the balls on the BGA then you are possibly overheating the paste/flux quite a bit. most lead pastes do not like much more than 230 C. I am assuming that you have a decent p
Electronics Forum | Wed Oct 04 14:48:49 EDT 2006 | cw
My soak at 150C - 180C for approx. 85sec to 100sec. I believe this is sufficient. I can't change my paste because customer wants to use SnPb paste with SAC solder balls. They claimed that they have sucessful result with other CM. I need to know if
Electronics Forum | Tue Oct 17 09:27:23 EDT 2006 | SWAG
We had a build that showed a relatively high occurence of BGA voids like you were seeing. It was a very small volume first article that took a long time to get through the line so the paste sat on the boards too long. As we ramped up TACT time in p
Electronics Forum | Wed Dec 20 11:21:50 EST 2006 | SWAG
We ended up switching PCB suppliers and PCB material altogether. We built 400+ units with the new material and got zero delamination. It's still unclear what the real solution is as we introduced two changes at once. This new supplier is going to
Electronics Forum | Tue Oct 31 20:54:12 EST 2006 | Joseph
Dear all, Do you know any simple method to measure the bending strain on a PCB. I have heard of something like a special tape that changes colour when bent. This can be stick to a PCB to find the bending stress/strain but I cannot find anything on t
