Electronics Forum: chapter 8 (Page 1 of 2)

Re: Component staking

Electronics Forum | Tue Jun 06 13:41:16 EDT 2000 | Charles Harper

I would like to refer you to John W. Kratz, author of Chapter 8, as listed at the top of the forum. John is the outstanding specialist in this subject area.

Need help on PCBA Cleanliness Standards and Specs

Electronics Forum | Tue Nov 25 17:43:09 EST 2003 | Gabriele

Try to see J-STD-001 Chapter 8.Cleaniness Requirements. Also you could info also on ASTM D5127-99. Rgds

CSP and underfill

Electronics Forum | Fri Aug 23 16:02:37 EDT 2002 | davef

Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John Lau; McGraw-Hill Professional; ISBN: 0071351418; 2000 * Chapter 6. Flip Chip on Board with Conventional Underfills. * Chapter 7. Flip Chip on Board with No-Flow Underfills. * C

Re: Glop-Top

Electronics Forum | Thu Jul 06 20:46:17 EDT 2000 | Dave F

Mark: An area of increasing interest to all of us. From the SMTnet "Terms & Definitions" (or whatever they call it) Globtop. Encapsulant. Encapsulating. Encapsulation. Potting. Enclosing an article in an envelope of adhesive or encapsulating co

Cleaning of PCBA's

Electronics Forum | Thu Apr 14 13:10:49 EDT 2005 | Shean Dalton

Hi John, A primary consideration is the type of flux you are using. If it's water soluble (organic acid) then cleaning is highly recommended. Any other flux that fails the copper mirror test, we'd strongly recommend cleaning. Passing the copper m

Tin/lead Solder Leaching Dendrites

Electronics Forum | Wed Jun 07 11:25:23 EDT 2000 | Dave F

In the portion of Chapter 1 on Flip Chips, Ken Gallio states (1.8.2.1) "tin/lead solder leaching or dissolving gold and form metal compounds, called dendrites, that greatly reduce joint reliability because of high brittleness." What is the compositi

FMI Protocol

Electronics Forum | Wed Aug 30 03:58:26 EDT 2006 | Ola

Yes you do need a different upline interface card. This information should be in Your Technical Reference Manual, Electronics enclosure chapter 6? Y2 Enclosure, card position X8 Downline and X9 upline: Part No Description. 112045 Base Card

Can CSM84V and CSM84VZ do 0402 ???

Electronics Forum | Mon Apr 17 22:54:51 EDT 2006 | Darby

Short answer is - not really. According to the manual in Chapter 1-5 Supply devices (Feeders) overview "There are also available an 8mm tape feeder which handles 1005(0402) square chips". I have never seen one. The problem is that even an H nozzle is

Filter full occurred error coming at every autochanger over in NPM machines

Electronics Forum | Thu Mar 28 20:06:53 EDT 2024 | cbeneat

What type head is it? Try changing the internal filters. If it is a low number head, ie: 1-4 on an 8, 1-6 on a 12 or 1-8 on a 16. These can be accessed by pushing the head to the opposite table for removal. Chapter 11, section 11-6 page 11-6.3 in mai

Looking for a Book/Guide for PCB assembly using SMT

Electronics Forum | Mon Jan 17 07:48:37 EST 2011 | davef

SMTnet Newsletter Aug 1999 by B Ellis Title: A Comprehensive Guide to the Design and Manufacture of Printed Board Assemblies Vol. 1 & 2 Editor: William Macleod Ross Publisher: Electrochemical Publications Limited, GB This two-volume work can p

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