Electronics Forum: characterization (Page 1 of 13)

Wavesolder process characterization

Electronics Forum | Thu Jan 29 12:47:53 EST 1998 | Henry Lee

I have an Electrovert Ultrapak 445 Wavesolder machine with 3 IR preheat zones and a single wave with omega wave. I want to run a DOE (Taguchi) to determine the optimum settings for soldering both single-sided and double-sided boards. Can anyone po

Re: Wavesolder process characterization

Electronics Forum | Thu Feb 19 12:45:05 EST 1998 | Earl Moon

| I have an Electrovert Ultrapak 445 Wavesolder machine with 3 IR preheat zones and a single wave with omega wave. | I want to run a DOE (Taguchi) to determine the optimum settings for soldering both single-sided and | double-sided boards. Can any

Re: flip chip bonder

Electronics Forum | Thu Sep 24 13:17:34 EDT 1998 | Dave F

| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Parag: Check the link bel

flip chip bonder

Electronics Forum | Wed Sep 23 20:38:30 EDT 1998 | parag

does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap.

Re: flip chip bonder

Electronics Forum | Thu Sep 24 07:43:12 EDT 1998 | Earl Moon

| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Characterization means det

IPC.....

Electronics Forum | Tue Jun 08 07:10:54 EDT 2004 | davef

Not quite what you seek, but as close as you're going to get ... 9850-K - Surface Mount Placement Equipment Characterization - KIT (Hard Copy & CD-ROM) ANSI Approved This standard has been developed to standardize the parameters, measurement proc

Mysterious reflow problem

Electronics Forum | Sat Sep 19 09:52:09 EDT 2009 | profilingguru

Before you rule out the profile, did you run an actual profile of the board or run machine characterization? How old are your TCs? Have you run them more than a half dozen times? Is your profiler calibrated. In my experience making a living of pr

cph fpr pick & place

Electronics Forum | Wed Jan 17 07:51:19 EST 2007 | davef

IPC-9850, Surface Mount Placement Equipment Characterization

SMT OEE Calculator

Electronics Forum | Sun Nov 08 18:06:23 EST 2009 | davef

Is this machine capacity constrained? Are you using IPC-9850 Surface Mount Placement Equipment Characterization?

Intercomnect Characterization

Electronics Forum | Wed May 31 05:32:14 EDT 2000 | F.Frimpong

Hi All, I am looking to design some test structures on GaAs and High resistivity silicon for the high frequency characterization of interconect materials. (Organic substrate, vrs LTCC, Flipchip bump configuration: (metallurgy, shape height etc) conta

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