Electronics Forum | Mon Jul 24 23:34:14 EDT 2000 | rzkr438
I am tyring to find out shear force requirement for BGA attached on board .I measured two group for shear force to check underfill process effectiveness on BGA .Two group showed siginificant force diferrence .I am very sure underfill process is effec
Electronics Forum | Wed Jul 19 16:28:31 EDT 2000 | Boca
Kinda along the lines 'if it comes we will build it'. Perhaps you can assemble it, I've not done it, but a question to ask a bit earlier is - should we. Check the specifications for the component, published by component vendor. Most of them really
Electronics Forum | Fri Jul 07 11:06:44 EDT 2000 | John O'Brien
You ought to consider Data Matrix directly marked on the boards It can be done with laser, inkjet, or other permanent marking methods. Never falls off, can be read even if 30% is obliterated. For an example, check any AMD (K6, K7) or Intel Pentium c
Electronics Forum | Thu Jun 29 09:36:04 EDT 2000 | JAX
Peter, There is no truth's about the way things are, How something is done is only bound by who is doing it. You can check the archives for info to get you going but it's all up to you. As far as placement order, it all depends on what you are placin
Electronics Forum | Tue Jun 20 10:15:55 EDT 2000 | Neil Peaslee
I checked your account and I see that you use a couple of different computers to log into SMTnet. One at work and one at home, perhaps. One of the computer is not set up for cookies and unfortunately we lost track of your login information. (We try t
Electronics Forum | Sun Jun 04 07:37:57 EDT 2000 | Dreamsniper
CK, just curious...is the via located close to a pad or land? if yes, what's the gap between the via pad and the component pad/land edge ? what's the Via hole size? Have you checked where does the solder that bleeds out of the via come from? Please
Electronics Forum | Sat May 27 14:09:23 EDT 2000 | do ngoc hung
MAY YOU HELP ME TO SOVLE THE PROBLEMS IN MACHINE. I CAN NOT CHECK NOZZLES IN CENTER, BRIGHTNESS MODE OR THE CCD CAMERA CAN NOT CAPTURE THE NOZZLES. SO MAY I HAVE ANY INFO ABOUT IT. PLS GIVE ME A ADVICE ASAP VIA EMAIL. THANKS AND BEST REGARDS. DO
Electronics Forum | Tue May 30 20:56:27 EDT 2000 | Dave F
Chua: No AI on SMT troubleshooting that I'm aware of. Don't dispare though, we're here to help you. Consider checking the SMTnet archives. There is a bountiful amount of information there. Good luck. And we hope over time that the burden of hav
Electronics Forum | Tue May 16 20:43:22 EDT 2000 | Dave F
Ashok: Hey guy ... snow starting to melt yet? Keeping process insultaors with a charge of over 2kv a foot from ESDS items seems reasonable. The HBM assumes contact with the item, so it should have a lower potential. You should double check with E
Electronics Forum | Fri May 12 13:42:38 EDT 2000 | Steve Thomas
I also recommend that you take a peek at the archives, as stencil cleaners have been discussed a number of times. I also recommend that you check with your stencil manufacturers to determine exactly what cleaning process parameters are acceptable to
.png)
