Electronics Forum | Thu Jun 24 11:44:20 EDT 1999 | Matt Stump
I am looking for a way to clean solder off of QFP packages. I'm thinking a chemical method would be easy, as long as the chemistry doesn't attack the leads themselves, or the package. Any suggestions?
Electronics Forum | Mon Aug 06 12:14:35 EDT 2001 | seand
Hello All, The audacity to yell Smartsonic here is appauling. This is a process approach dependent on the type of epoxy. To suggest your equipment without knowing a thing about the process is shameless. OK, now I'll get off my soap box. The low
Electronics Forum | Mon Nov 30 21:56:31 EST 2020 | emeto
Did you try a ramp to spike profile? My thought is that you burn all your flux in your long soak and when the actual reflow happens, you have no flux activators working. Also will be interesting to see your profile and know more about the defects. Is
Electronics Forum | Thu Jun 26 08:49:21 EDT 2003 | caldon
Depends on your Material (Chemistry) and Machine. We use a hot plate with the material in an "L" patern. The Hot plate is used only in aiding the capillary action. Also, is time an issue?? Here is a good paper from Asymtek that was poster in Advan
Electronics Forum | Fri Nov 02 19:34:19 EDT 2018 | sarason
I am assuming that your application is Automotive. The logic here is that the product has got to at least run for 8 years or more. The prebake removes any moisture that may creep into the product during the wait time. A little moisture combined with
Electronics Forum | Sun Jun 27 06:27:15 EDT 1999 | Vic Lau
| I am looking for a way to clean solder off of QFP packages. I'm thinking a chemical method would be easy, as long as the chemistry doesn't attack the leads themselves, or the package. | Any suggestions? | Dear Matt, I have a customer, who is com
Electronics Forum | Mon Jun 28 14:36:34 EDT 1999 | John Thorup
| | I am looking for a way to clean solder off of QFP packages. I'm thinking a chemical method would be easy, as long as the chemistry doesn't attack the leads themselves, or the package. | | Any suggestions? | | | Dear Matt, | | I have a customer
Electronics Forum | Tue Aug 19 12:15:37 EDT 2003 | D Peter
Again, that is for packaging, rather than moisture removal or storage. Those guidlines are for several reasons, preventing low pressure outgassing or disassociation of the dessicants, damage to parts or wafer tray due to forces on the evacuated pack
Electronics Forum | Wed Mar 01 17:03:56 EST 2000 | Dave F
Steve: Someone is trying to trick you. He/she is trying to be very smart, but he/she didn�t anticipate this "dark haze" coating problem. I suspect that this person is someone you speak with every day in your plant. They may be the one that came-u
Electronics Forum | Wed Mar 01 17:03:56 EST 2000 | Dave F
Steve: Someone is trying to trick you. He/she is trying to be very smart, but he/she didn�t anticipate this "dark haze" coating problem. I suspect that this person is someone you speak with every day in your plant. They may be the one that came-u
