Electronics Forum | Thu Nov 17 20:51:16 EST 2005 | cangly
Morning Mike, We use Pb63/Sn37, Alpha Metal alloy. Solder pot is at 250 C. The profile of board after Preheat about 100 C, Lambda Wave about 220C (use both Lambda and Chip wave), DWell time 2.1s ~ 3s. Conveyor speed 1.5 in/min. We run by bare board a
Electronics Forum | Sun Nov 27 20:47:51 EST 2005 | lerry king
such as : 1, Proof of Design (POD) The DFM/CE Book for Printed Circuit Boards, Assemblies and All Manner of Other Things Technical - by Earl Moon 2, Surface-Mount Technology for PC Boards James Holloman PROMPT Publications July 1995 509 pages 3,
Electronics Forum | Sat Dec 10 19:10:17 EST 2005 | mika
Most of the chip; res & caps are already lead-free or RoHS compliant and you most certainly already solder them in your regular leaded reflow process. However, there are a few more component packages except from BGA:s that are NOT backwards compatib
Electronics Forum | Fri Dec 02 08:52:05 EST 2005 | pavel_murtishev
Good evening, I�ve just solved very similar soldering issue. In my case the problem was with 0603 chips. Solder joint had same appearance. I suspected that solder do not melted and increased TAL and peak temperature. No result. Next thing I tried to
Electronics Forum | Fri Dec 16 15:23:04 EST 2005 | Csabee
I think the Samsung SM320 is quite good machine..But I suggest that must assembly feeder cover to the feeder trolleys, because without that the tape feeders are not safe for the heads. Feeders should broke the head. chip components wrong light sett
Electronics Forum | Mon Dec 26 10:45:40 EST 2005 | davef
+85*C. * Wave solder preheats are >100*C just prior to entering the wave * Temperature changes between exiting the chip wave and the laminar wave can swing through >100*C * Do not exceed 3*C per second maximum rate of change in temperature. Generall
Electronics Forum | Tue Jan 31 17:14:51 EST 2006 | Chris
I would not go by any general rules at all. Test the product! Thermal cycle it and shock and vib test it. Got burned on a part that had 0.010" dia bumps. Manufacturer stated undefill was not necessary on their part due to bump size. I wanted to u
Electronics Forum | Fri Mar 24 13:25:24 EST 2006 | patrickbruneel
See Samir that's what happens if you go too lead-free seminars, they feed you crap. If they served you lunch with bismuth chips its time you see a doctor or you end up like WML. By the way any takers?? Who in this forum volunteers to be the first to
Electronics Forum | Tue Apr 18 04:54:30 EDT 2006 | bayanbaru
We are using Siemens pick and place machine for chip placement. Our goal is to continuous production during component replenishment. In Siemens machine, the feeders that can be removed, reloaded, and placed back on the machine while the machine is ru
Electronics Forum | Wed Apr 26 05:03:30 EDT 2006 | Darren
Hi We have a new product that has a 22uF 0805 X5R 6.3V Chip Cap. It is placed on standard 0805 pads but is 1.25 mm high and although we are not getting the best fillet it appears sufficient. The trouble is we are getting a small number of returns
