Electronics Forum | Wed Jul 10 18:19:42 EDT 2002 | davef
Flex cracking under the terminations is generally regarded as one of the primary causes of failure of ceramic chips. If you can see cracks in the solder joints from board flex, those chips are certainly strongly suspect, and you must assume there is
Electronics Forum | Mon Jun 20 09:12:55 EDT 2005 | davef
There's no easy answer. It depends on: * Thickness and size of the PCB in the array. * Means of separation. * Type of component. SMT components are more sensitive to the forces that need to be applied to separate the PCB. * Type SMT device. Ceram
Electronics Forum | Tue Feb 28 16:58:39 EST 2006 | PWH
Too fast heating/cooling rate in reflow (look at mfg's spec.). Z "overdrive" on pick and place or chipshooter though unlikely I would say. Depanelization method (bending a scored board to break it is tough on things). Bad PCB design - cap. too clo
Electronics Forum | Mon Jun 30 10:52:36 EDT 2003 | Bob
Suggest you ask vendor for a failure analysis. Ceramic chips have specific signatures for mechanical or thermal shock cracking. The vast majority of failures are due to mechanical flex. Depanelization and secondary operations such as hand insertion
Electronics Forum | Fri Jun 11 11:36:23 EDT 1999 | John Hardy
Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from manufactu
Electronics Forum | Fri Nov 02 08:10:40 EDT 2007 | floydf
Has anyone ever looked into the possibility for > laser marking 1812 size X7R ceramic chip > capacitors injecting sufficient energy to cause > cracking when voltage is applied? If so, what > were the findings? We are having failures of > caps
Electronics Forum | Wed Oct 31 16:56:11 EDT 2007 | glenearl
Has anyone ever looked into the possibility for laser marking 1812 size X7R ceramic chip capacitors injecting sufficient energy to cause cracking when voltage is applied? If so, what were the findings? We are having failures of caps from one manufa
Electronics Forum | Thu Jun 17 06:04:48 EDT 1999 | Ron G. Belliard, EET
RE: Cracked Capacitors: I have worked for 3 1/2 yrs with SMTA and have found a similar problem with capacitors. Throughout my studies of the problem, I have discovered three contributing factors that caused this cracking either individually or in co
Electronics Forum | Sat Jun 12 10:46:32 EDT 1999 | Dean
| Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from manufac
Electronics Forum | Wed Nov 25 12:33:16 EST 1998 | Scott Snider
| A buddy of mine has problems after depaneling double sided pre-scored PCB's. Resistors near the edge, after put into the slice and dice machine contain micro cracks. He's checked for them before and after depaneling. We figure it is the sectioni
