Electronics Forum | Fri Aug 04 05:10:57 EDT 2000 | Dougie
Hi, We use a mixture of plastic tape carriers and paper tape carriers for placing chip components. We are experiencing a problem which I know is a problem across the industry...when using the plastic carriers, the chip components stick to the tape c
Electronics Forum | Tue Jun 10 17:13:44 EDT 2014 | grauen06
I have seen this on a MyDATA machine and we had to slow our feed rate of the feeder down. That seemed to do the trick. We concluded the carrier tape was too large for the part, but our vendor didn't really seem to care.
Electronics Forum | Fri Sep 07 07:39:11 EDT 2001 | caldon
Can you confirm the components are being picked up from the feeders? If the Feeder table calibration is incorrect the components could be picked up off from the begining. This would result in 1) nozzle barely picking up the part and as the head moves
Electronics Forum | Tue Feb 28 16:58:39 EST 2006 | PWH
Too fast heating/cooling rate in reflow (look at mfg's spec.). Z "overdrive" on pick and place or chipshooter though unlikely I would say. Depanelization method (bending a scored board to break it is tough on things). Bad PCB design - cap. too clo
Electronics Forum | Tue Jul 05 07:02:26 EDT 2022 | richardcargill
Possibly, yeah. Or the wrong sized nozzle ( or chipped or blocked ) We have problems occasionally with larger components and vacuum levels. If the component has a makers 'circular void' on the pick up surface then the actual pick coordinates have to
Electronics Forum | Wed Feb 16 20:51:37 EST 2000 | Jim
We have to place some LCC208's. The terminations are flush with the underside of the package, on an 0.5mm pitch. The pads on the board are flat tin. We'd like to get the part up in the air a little to provide some clearance for cleaning. Is there a w
Electronics Forum | Wed Feb 16 20:51:37 EST 2000 | Jim
We have to place some LCC208's. The terminations are flush with the underside of the package, on an 0.5mm pitch. The pads on the board are flat tin. We'd like to get the part up in the air a little to provide some clearance for cleaning. Is there a w
Electronics Forum | Tue Jul 13 05:21:04 EDT 2010 | bubbobbed
Guys, I've received complaints from customer that the chip is sticking on the cover tape or carrier tape when detape. Is there any possible that i can solve the problem by changing the cover tape or carrier tape?? some say the root cause of this issu
Electronics Forum | Thu Mar 01 16:58:05 EST 2001 | davef
Last time we looked at this, JEDEC carefully designated the dimensions of the carriers, but "neglected" to define the component orientation with the carrier. Go to http://www.jedec.org/download/, search for JEP95 JEDEC REGISTERED AND STANDARD OUTL
Electronics Forum | Tue Aug 19 12:15:37 EDT 2003 | D Peter
Again, that is for packaging, rather than moisture removal or storage. Those guidlines are for several reasons, preventing low pressure outgassing or disassociation of the dessicants, damage to parts or wafer tray due to forces on the evacuated pack
