Electronics Forum: chip component backward compatibility (Page 2 of 4)

Sn/Pb paste with SAC plating

Electronics Forum | Thu Oct 21 16:31:23 EDT 2004 | Tony

I have a component manufacturer that is using Sn/Ag/Cu plating on chip caps and resistors. Does anyone have any information on compatability with Sn/Pb paste. Are any changes in profile required? Is the reliability of the solder joint at risk? Tony

lead free components in leaded process

Electronics Forum | Mon Jul 16 10:51:09 EDT 2007 | patrickbruneel

D. Hillman, et al., �The Impact of Reflowing a Pb free Solder Alloy Using a Tin/Lead Solder Alloy Reflow Profile on Solder Joint Integrity,� International Conference on Lead-free Soldering, CMAP, Toronto, Ontario, Canada, May 24-26, 2005, http://www.

Re: Wave Soldering Active Components

Electronics Forum | Sun Mar 21 06:27:45 EST 1999 | Bob Willis

| Hi Folks, | This is my first surface mount board, so I asked our assembly house for some tips. They said only passives on the bottom side-preferably no smaller than 0805, 0603 only if I have to. I would think that an SOT-23 would be OK on the botto

Fiducials on feeders

Electronics Forum | Wed May 22 15:56:43 EDT 2002 | stefwitt

The play of the tape is quite significant as I mentioned in an earlier thread. Tape width can vary between 8.1 +/- 0.2mm. Demos on 0201's are most likely done with 8.1 +/- 0.05mm tape. I guess you are referring to the cover tape pull, which can dispo

Ag/Pd termination reflow soldering issues

Electronics Forum | Wed Apr 18 08:14:20 EDT 2007 | davef

Silver palladium termination * AgPd-terminated capacitors are designed for conductive adhesion. Reflow or wave soldering is not recommended. [EPCOS Multilayer ceramic capacitors, Soldering directions, October 2006] * CONDUCTIVE EPOXY BONDING. Epoxy c

Converting to 'No-Clean' process

Electronics Forum | Fri Apr 14 13:30:20 EDT 2000 | Murad Kurwa

Hi All: Can you tell me specifically if you converted an exiting product made with Clean process using WS609 or compatible to 'No-Clean' process. We have to convert assemblies from current clean process at a CEM to No-Clean process in our own factor

Reflow help needed, Hotflow 5

Electronics Forum | Fri Sep 09 21:09:20 EDT 2011 | hegemon

Wow, a lot of questions here...and you are definitely doing some "tough sledding". To the point. If you have 3 - 22" zones you'll have to calc your belt speed and temperatures to match the solder paste requirements with regard to flux activation an

Re: soldering to hard gold plated PCBs

Electronics Forum | Wed Feb 03 23:40:26 EST 1999 | Chris G.

| Does anyone know if I will have problems soldering surface mount components to an all hard gold plated PC board. We want to use hard gold similar to gold used for edge fingers because our customer is concerned about wear and conductivity of connect

Upside Down Chips

Electronics Forum | Thu Mar 15 08:16:28 EST 2001 | davef

In a similar conversation ... Alex Krstic, NovAtel Inc. said ... Hello all. We recently received some boards with some of the chip resistors placed with their resistive elements towards the board. J-STD-001B and C view this as violation for both Cl

Re: In-line lead trimmers

Electronics Forum | Fri Oct 23 16:19:14 EDT 1998 | Dave f

| I have been requested to explore the possibilities of using an inline lead trimmer in our manufacturing process. I have a few questions I need answered. | 1. Can anyone recommend a good model of trimmer for in-line use? | 2. We do double sided SMT,


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