Electronics Forum | Sat Dec 10 19:10:17 EST 2005 | mika
Most of the chip; res & caps are already lead-free or RoHS compliant and you most certainly already solder them in your regular leaded reflow process. However, there are a few more component packages except from BGA:s that are NOT backwards compatib
Electronics Forum | Wed May 24 16:40:40 EDT 2006 | samir
Yikes! Sounds like a hairy situation there. I've successfully collapsed a Pb-Free BGA (using a Sn/Pb solder paste), with a peak temperature of 220 Deg. C and Time Above SAC's Eutetic point (217) of 17 seconds. Beware of overcooking your smaller ma
Electronics Forum | Wed Jul 06 03:23:14 EDT 2005 | javi
We start to get mixed component leaded and lead-free, we still using leaded solder paste in the SMT process. Do you see this a problem to use leaded process 179 deg celsuis temperature reflow on RoHS compatible lead-free components with same specific
Electronics Forum | Thu Sep 11 10:45:41 EDT 2008 | diesel_1t
Is just me, or too many "soldering issues" have been observed lately? on this forum... could be a ~90% components "backwards/compatible" in both leaded/lead free process?
Electronics Forum | Sat Dec 17 14:51:45 EST 2005 | Ola
"What worries me is that a lot of people speak about what they have heard, but there is no firm facts on exactly what the situation is." I do not understand this reply, because what can we do beside listening & read, unless we sometimes ourself do t
Electronics Forum | Tue Sep 16 16:30:49 EDT 2008 | ck_the_flip
Vlad, yes, he made no mention of a BGA, but I thought I'd just throw it in there. Many people are concerned with the "backward compatible" scenario - running RoHS parts with a Sn/Pb solder paste. The scenario's a no-brainer with most components, bu
Electronics Forum | Mon Oct 03 16:19:22 EDT 2005 | Amol
for backward compatibility applications (such as this), the higher melting temperature alloy (LF alloy) gets the priority in selecting the reflow profile. you are using too low temps for reflow. your LF alloy wont reflow at these temp and you will e
Electronics Forum | Wed Jul 12 11:35:07 EDT 2006 | samir
Let's pretend there's no complication with RoHS, backward, foreward compatability - bla, bla, bla Vikings. I would pick the BGA hands-down! 1.) The BGA Ball, the component's lead, IS the solder joint! 2.) No complanarity issues, bent leads, etc
Electronics Forum | Fri Dec 16 19:48:16 EST 2005 | Ola
Mika has a point here. AMD has some RoHS compliant components that are Not backwards compatible, in terms of leaded soldering paste & reflow temperature! They are Not willing to tell You Why! I think it has to do with something like: http://www.webel
Electronics Forum | Wed Aug 24 09:52:26 EDT 2005 | javi
Patric, The product is exempted from the RoHS regulativ 1'st phase(2010) and our policy is to follow the new EU regulations as this will also push the Industri technolegy and the SMT process. Our concern is more that we are not able to qualify the p
