Electronics Forum | Mon Jan 29 10:26:21 EST 2001 | CAL
David- The information you ask about is what we deal with on an every day basis. We can entertain your questions off line at your convenience. The POC here at ACI you need to speak with is Mike Czajkowski (CHI-Kow-ski). He should be able to provide d
Electronics Forum | Mon Sep 10 19:47:23 EDT 2001 | djarvis
We recently trialled a range of different solder pastes. Some just did not have the "green strength" to hold the components when placed by the higher speed machines. I'd never seen this before and spent a day and a half checking all the things everyo
Electronics Forum | Fri Apr 16 15:12:12 EDT 2021 | jsmith01
Does anyone know where the power to the lambda, chip sensors comes from on a Electrovert EPK plus? I have an intermediate issue with these sensors loosing power and the wave just keeps going higher and flows over the pot. I have replaced the senors
Electronics Forum | Mon Dec 13 18:17:44 EST 1999 | Calvin Wong
We have this solder ball & beads around chip components since day one of manufacturing using non-clean process. We managed to eliminate the solder beads around ceramic type chip componenets when we have a slow ramp up of pre heat at solder reflow. Ho
Electronics Forum | Wed Sep 07 10:42:28 EDT 2005 | Rob
or the biggest issue from my days with the worlds largest Chip cap producer..... Incorrect part data or adjustment on a chipshooter (z height).
Electronics Forum | Mon Nov 08 12:47:52 EST 2004 | clampron
Good Day Everyone, I have a BGA rework that has some chipped/damaged solder mask that will need to be repaired prior to BGA replacement. I was wondering what materials are being used in the industry for this type of application. Any help would be g
Electronics Forum | Wed Jul 09 10:55:51 EDT 2003 | Veronica
Hi Reman01, I have done that before when I was in Motorola. What kind of ball are you trying to repair? How many pieces of BGA chip do you need to repair a day? If it is not too many, you can do it by yourself. It is a lot, such as 100 to 1000 piece
Electronics Forum | Fri Jul 21 17:25:02 EDT 2006 | ahmedrehan
For calculation let me keep future production in mind so for producing 1000 board/day X 110 component means 1,10000 / 8hr/day = 13,750 cph so I have to select a chip shooter between 15-20k cph. any sujested model of Fuji or Panasonic with this speed.
Electronics Forum | Tue Jan 09 22:04:48 EST 2007 | Guest
Set Up Guy, I am not sure if the COB you are refering to means Circuit on Board . If yes, this process also include SMT . Package is a combination of some passive components and bare die. Passives are normally attached thru SMT using solder te
Electronics Forum | Sat Feb 22 11:27:16 EST 2003 | stefwitt
In the early days of SMT we were using vibratory bulk feeders for chip components. It was quite obvious that some of the components had to try several times getting through the gravity trap or with the right side up through the light sensor. As a res
