Electronics Forum | Fri Oct 16 16:11:52 EDT 1998 | Joe Belmonte
| | Hi Folks, | | As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your proc
Electronics Forum | Thu Apr 04 05:33:19 EST 2002 | ianchan
Hi, hope this helps : 1) BCC (bump chip carrier) production for us, was with a 5mils Stencil. The outer perimeter smallish pads are not much of a problems. For the central large pad, we split the paste print (corresponds to the Stencil apperture op
Electronics Forum | Wed Oct 03 23:59:44 EDT 2018 | gaintstar
Flason SMT problem solving: http://www.flason-smt.com/new/PRINCIPLE-OF-SURFACE-MOUNT-PROCESS-SMT-PROCESS.html http://www.flason-smt.com/new/Printed-Circuit-Board-PCB-Price-Estimator.html http://www.flason-smt.com/new/Printed-Circuit-Board-Solder-res
Electronics Forum | Thu Oct 04 00:07:29 EDT 2018 | gaintstar
flason smt SMT spare parts: http://www.flason-smt.com/product/SMT-spare-parts-Assembleon-Controller-Bvm-5322-216-04698.html http://www.flason-smt.com/product/SMT-spare-parts-Assembleon-Control-V2-1-Rev-B-8mm-4022-594-10010.html http://www.flason-smt
