Electronics Forum | Wed May 27 11:54:29 EDT 2009 | allwave
Armando, Make sure chip wave is pumping evenly across. These TD machines require a lot of maintenance (deep cleaning)to ensure all the holes on nozzle are open... My two cents, George
Electronics Forum | Fri May 29 02:08:08 EDT 2009 | cobar
Check that you are getting an even spray pattern from the fluxer.Check that the chip wave nozzle is clean and if possible feed the PCB in to the wavesolder unit at 90 � or 180�.
Electronics Forum | Thu Sep 11 23:50:51 EDT 2003 | Dean
Epoxy is hydroscopic. A cavity will form when the cure furnace reaches the boiling point of water. The steam expansion creates the pocket. It can be large enough to be filled with molten solder from the wave machine and cause a hard short under th
Electronics Forum | Thu Sep 11 15:23:31 EDT 2003 | Peter L.
I have come across a rash of failed assemblies that have 0805 capacitors and resistors, bottom side glued, wave soldered and washed. Trouble shooter reported touching up the solder joints on a few areas and the boards would pass test. I had a look a
Electronics Forum | Tue May 17 10:11:54 EDT 2005 | russ
I would use a foam fluxer since spraying rosin will make the stickiest nastiest mess you can imagine. 18 layer board huh? You will want convection preheat, both top and bottom preheaters, preheat tunnel of at least 4-5', a chip wave, laminar flow w
Electronics Forum | Sun Oct 03 18:26:17 EDT 1999 | park
What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? How about curing bottom side first and reflowing top side later? What percentage of companies run reflow/cure/wave for
Electronics Forum | Wed Oct 06 20:42:50 EDT 1999 | Mike Cooper
Yes. We use high speed dispensing (PanasonicFA)as an integral part of our PCB assembly. Our business is automotive electronics and our typical product is 2-sided smd with some through hole. We assemble topside first, through hole, then bottomside. Th
Electronics Forum | Mon Oct 04 07:47:34 EDT 1999 | park kyung sam
| | What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? | | | | How about curing bottom side first and reflowing top side later? | | | | What percentage of companies run
Electronics Forum | Mon Oct 04 04:01:10 EDT 1999 | Chris May
| What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? | | How about curing bottom side first and reflowing top side later? | | What percentage of companies run reflow/cur
Electronics Forum | Sun Oct 03 21:36:57 EDT 1999 | JAX
| What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? | | How about curing bottom side first and reflowing top side later? | | What percentage of companies run reflow/cur
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