Electronics Forum | Thu Aug 21 08:15:07 EDT 2008 | naynayno
Thanks Dave, I will be sticking with Manufacturing Engineering. These are good guidelines but what is standard clearance for various packages? This is a dimension we usually seek by eye, whether we will have a problem or not. We use straight DI -
Electronics Forum | Thu Aug 21 08:33:09 EDT 2008 | davef
There is no standard as such. It's easy to see why. It's too complicated and has such a small payoff. Standoff is comprised of: * Package height * Solder thickness between the pad and the component lead * Delta of pad thickness and solder mask For p
Electronics Forum | Wed Aug 20 17:05:42 EDT 2008 | naynayno
We have experienced contamination under flat chip arrays. The lab report is still open but it appears to be dendrite growth. We have been trouble-shooting our process and cleaning equipment. My question is are there any specific design or best p
Electronics Forum | Wed Aug 20 20:10:30 EDT 2008 | davef
Naw, accounting is boring. Standoff could be an issue. Coupla things: * Above 30 thou, just about any cleaning process, more sophisticated than a garden hose, will produce acceptable results * Below 10 thou, can be cleaned with best efforts, but not
Electronics Forum | Thu Apr 12 00:43:38 EDT 2001 | zam_bri
Can anybody gimme some input on the problem I faced currently on 0402 Chip Resistor. At pre-reflow the component are placed nicely but at post reflow, we found the Resistor stands sideway ( both termination, the pad and componant are in contact, fun
Electronics Forum | Thu Apr 12 02:30:18 EDT 2001 | zam_bri
Thanx for your valuable feedback,Eric. Do you mind sharing with me the pad size change that you have made. I mean from what size to what size. I'm measuring mine now...cheers
Electronics Forum | Sun Apr 15 23:12:00 EDT 2001 | Eric Chua
The size i had changed from 55 x 20 mils to 42 x 20 mils. The component size i have is 40 x 20 mils ( 1mm x 0.5mm ).
Electronics Forum | Thu Apr 12 01:23:04 EDT 2001 | Eric C
Check the pad size. I had this issue before due to the pad size too wide. R&D had change the size of the pad and is solve the issue. Before the pad size change, I had rebuild another stencil with the pad opening close to the component size. It won't
Electronics Forum | Wed Apr 26 06:09:12 EDT 2017 | ajaytyagi
Hi, Pl let me know about opinion/experience whether thick film chip SMD resistor which is MSL-1 Required to bake before being usedon SMT line. I want to use SMD resistance spool which is around 2 yeasr old kept at 25 deg room temperature at around 4
Electronics Forum | Thu Apr 27 02:39:50 EDT 2017 | ajaytyagi
Thanks for sharing your experience. I have similar view too.
