Electronics Forum: chip resistor element micro-crack (Page 1 of 2)

Re: Issues depaneling

Electronics Forum | Tue Nov 24 11:13:11 EST 1998 | Keith

| A buddy of mine has problems after depaneling double sided pre-scored PCB's. Resistors near the edge, after put into the slice and dice machine contain micro cracks. He's checked for them before and after depaneling. We figure it is the sectioni

Urgent!! ... AI process after SMD Reflow Soldering

Electronics Forum | Thu Sep 15 11:28:11 EDT 2005 | LeeHoMa

hi Steve/Pete, Thank for your email to affirming our current mounting and soldering flow! In fact, I also don't see any problem for the pilot run(though in small volume - 500pcs). However, the problem is - I am challenged by my customer that the AI

Re: Issues depaneling

Electronics Forum | Wed Nov 25 12:33:16 EST 1998 | Scott Snider

| A buddy of mine has problems after depaneling double sided pre-scored PCB's. Resistors near the edge, after put into the slice and dice machine contain micro cracks. He's checked for them before and after depaneling. We figure it is the sectioni

Upside Down Chips

Electronics Forum | Thu Mar 15 05:59:08 EST 2001 | PeteC

Good point. I'm having trouble with the words "electrical elements" in the J-STD. Is a marking an "element" ?? An upside down chip resistor is certainly not a defect in that it does not negatively impact product functionality or dependability. I sugg

Chip Resistor Failure

Electronics Forum | Mon Mar 22 05:39:36 EST 1999 | Bob Willis

Has any one seen failures of chip resistors after 1-2 years where the junction between the silver termination and the restive element on the top of the ceramic has corroded through. This results in a high resistance failure after this period of time.

Re: Microcracking in SMT Pick&Place process

Electronics Forum | Thu Jun 25 09:37:48 EDT 1998 | Russ Miculich

The real causes of microcracking are not normally due to pick and place - particularly if you are using a piece of equipment with vacuum pick up and release. The real cause of microcracking is due to thermal stresses on the die and the choice of the

Stacking chips

Electronics Forum | Fri May 12 09:24:45 EDT 2000 | Ashok Dhawan

I need to install two SMD chips (0805) at one location. I refered to IPC-HDBK-001, fIG 6-24. When I solder the chips side by side, the ceramic side which is placed againgst solder pad- is already touching the solder. While I complete the solder joint

Re: Chip Resistor Failure

Electronics Forum | Tue Mar 23 02:32:23 EST 1999 | Bob Willis

| | Has any one seen failures of chip resistors after 1-2 years where the junction between the silver termination and the restive element on the top of the ceramic has corroded through. This results in a high resistance failure after this period of t

Re: Chip Resistor Failure

Electronics Forum | Wed Mar 24 02:23:14 EST 1999 | P.L. Sorenson - Technical Consultant

| | | Has any one seen failures of chip resistors after 1-2 years where the junction between the silver termination and the restive element on the top of the ceramic has corroded through. This results in a high resistance failure after this period of

Re: Chip Resistor Failure

Electronics Forum | Mon Mar 22 16:59:15 EST 1999 | B K

| Has any one seen failures of chip resistors after 1-2 years where the junction between the silver termination and the restive element on the top of the ceramic has corroded through. This results in a high resistance failure after this period of tim

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