Electronics Forum: chip shear test (Page 8 of 36)

glue measurement

Electronics Forum | Tue Oct 09 20:40:48 EDT 2001 | davef

No one suggested that you speak for other suppliers and nor would they want� you �to speak for them." You shouldn�t make this something that it isn�t. All that was requested courteously was suggestions of alternate suppliers that could be considere

Dummy Flip Chips - Supplier Needed

Electronics Forum | Tue Dec 21 10:27:12 EST 1999 | Aaron Unterborn

Looking for mechanical chips (daisy-chained / stiched) for flip chip (C4) testing. Any contacts or suppliers? Thanks.

SMT COMPONENTS TESTING

Electronics Forum | Sat Jan 07 06:32:04 EST 2006 | mskler

Can anybody suggest that how we can chek quality for soldering of chip capacitor & chip resistor. we are getting prob. of dry solder in chip components. All Replies should be highly appriciated.

Epoxy Push Test Specifications

Electronics Forum | Wed May 29 04:34:36 EDT 2002 | Nell

Hi, Does anyone know about the epoxy push test specifications for the SMT chips component. For example: 0603, 0402 and 0201 chips. As usual, your help is very much appreciated. Thanks in advance, Nell

Conformal over No-Clean

Electronics Forum | Fri Apr 26 09:32:22 EDT 2002 | blnorman

We conformally coat over NC solder paste. No problems. We're using a platinum catalyzed addition cure silicone. The only concern with this conformal coating is cure inhibition. You must test the coating over the residues to be sure there is no in

Solder joint strength

Electronics Forum | Wed Mar 30 16:07:24 EST 2005 | Dreamsniper

If there's no shear strength standard for solder joint, how will I define my pad width and length then. I have a 8.5 mils width and my component lead width is 8.66 mils based on manufacturer's minimum width specification. How will I identify that it

Same pattern of capacitor crack

Electronics Forum | Thu Nov 13 11:45:04 EST 2008 | pbarton

We have seen a similar problem. Turned out to be mechanical stress on the component caused by the method of location and clamping at ICT. Where is the component located on the assembly? Poorly adjusted clamping pillars on clamshell fixtures can cause

Solder Joint Strength Comparison

Electronics Forum | Tue Sep 04 10:48:49 EDT 2007 | lloyd

How do other people check their solder joint strength after a process change? For example, say you are getting wetting problems and you feel that a change to the reflow profile may help, or perhaps a slight change to the stencil aperture to reduce so

ICT

Electronics Forum | Sat Mar 10 08:05:09 EST 2007 | davef

Here's your test definitions [clipped from the dictionary in the fine SMTnet Library]: * Test, Automated. Computer controlled electrical testing of parts, assemblies, or finished products. * Test, Built-In (BIT). An electrical testing technique whi

Re: depaneling machines

Electronics Forum | Wed Dec 22 12:21:51 EST 1999 | Dave F

Jake: This'll get you started: 1 Read the archives 2 primary approaches to paneling are; * Moise bites * Singulation * Routing * Scoring * Shearing 3 Major depaneling technologies are: * Singulation (Wand 708.459.2400fax2421, Circuit Technolo


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