Electronics Forum | Mon Feb 08 20:09:49 EST 2010 | davef
Woody: Consider using test BGA with no chip in, but daisy chains that you can monitor. After soldering, run environmental tests and follow with electrical tests to determine if the product concept is good enough.
Electronics Forum | Mon Jun 29 13:54:54 EDT 1998 | Russ Miculich
Diane: I would suggest you contact Chip Supply in Florida and find out how and what they specify to their suppliers. They inspect, test, package, and distribute many suppliers chips for flip chip and other applications. I am sorry but I do not have
Electronics Forum | Thu Sep 30 12:02:20 EDT 1999 | Wolfgang Busko
| I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. | What is the best way to achi
Electronics Forum | Tue May 26 13:01:40 EDT 1998 | Earl Moon
| Regardless of what various inspection standards state, has anyone got any information on how the strength of a soldered joint changes with the amount of solder in contact with the legs. ie if there is 0.152um depth of contact how does the joint st
Electronics Forum | Tue Nov 15 08:41:04 EST 2005 | Joe Wesley
Since I asked the question - here is what we have identified. We are doing what we call a jump score. Routing critical areas with v-score in non-critical areas. We have optimized the v-score depth as much as we can without having separation through h
Electronics Forum | Mon Dec 19 10:23:47 EST 2005 | DannyJ
Hi Grant, Here's one paper I came across for a customer of ours, seems they had heard that pb-free bgas cannot be done in pb paste. http://www.leadfreemagazine.com/pages/pdf/Clech_APEX2004_Paper-final.pdf I have another from a swiss lab that did
Electronics Forum | Wed Sep 29 09:35:39 EDT 2010 | blnorman
Can any body help me that how can I check the > strength of the 0603 capacitor & how much it > should be? Is there any standard for the > soldering strength of the Diffrent SMT > packages. Manjeet singh I'm not aware of a standard that provides
Electronics Forum | Thu Aug 24 12:45:16 EDT 2006 | CKH
Hi Folk, recently, i have found about 5% of the PCBA failed because of the faulty 10uF Cermanic Chip - Short Circuit. Will this Ceramic Chip cause during the SMT Process (e.g Temperature), Functional Testing or from it Original incoming Capacitor (M
Electronics Forum | Tue Dec 21 15:27:01 EST 1999 | John Thorup
The 2000 Top Line catalog list about 10 types of flip chips and are available daisy chained. 714/898-3830 Practical components also lists several 714/899-8309 They both have test boards as well. John Thorup
Electronics Forum | Sun Sep 28 16:06:21 EDT 2003 | Keith Petersen
I am a QA engineer in a telecommunications company. I am searching for both electrical and mechanical reliability standards that govern chip on board tests. Are there similar standards to IPC or JEDEC for COB in rugged commercial applications? I a
