Electronics Forum | Tue Nov 05 06:51:59 EST 2002 | V.RAMANAND KINI
Hi, This is a widely discussed subject and since you have asked a brief explanation, I assume, you are a business man or a top executive in the company venturing in to COB. I waited to see if someone replies to you. May be it is a very old subject
Electronics Forum | Thu Apr 20 02:34:27 EDT 2000 | erico
Hi everbody , Could some one plaese tell me that how long and the cost to test a SMT chip with ICT?
Electronics Forum | Wed Mar 22 11:49:16 EST 2000 | Chris May
Can anyone recommend a solderability test kit. This would be used for SOT23, chip caps resistors etc; Thanks in advance, Chris
Electronics Forum | Thu Jun 14 23:21:30 EDT 2001 | oem boy
I am working on 0201 development for my company in the UK, and I am planning a rather extensive DOE for my reflow oven profile. I am planning on studying various ramp rates, soak times, times above liquidus, peak temps, etc... My biggest concern
Electronics Forum | Fri Dec 04 19:17:03 EST 1998 | Jason
Jeff, I used conductive epoxy for diebonding and chipcaps on hybrid xtal controlled osc. We were applying via stencil printer, then curing in a KME vertical cure, a real foot print saver. Even under controlled environmental conditions, it was a re
Electronics Forum | Mon Jan 13 18:22:55 EST 2003 | davef
100 sec) and decrease reflow temp to 205C. * Understand that voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on a temporary basis. There is no standard, IPC or otherw
Electronics Forum | Fri Feb 21 11:33:47 EST 2003 | Jaime
Call your glue manufacturer. It sounds to me that the epoxy is not curing properly. You should also test for shear strenght. How many pounds of pressure does it take to "pop" a cured component after it comes out of the oven? What type of oven do you
Electronics Forum | Fri Mar 07 05:36:21 EST 2003 | O' Connor
Hi Again, In answer to DaveF - Yes solder is fine where the solder paste is deposited , but the part of the pad visible after pasting is still visible after reflow. Previously the solder paste & all the gold diffused & flowed giving a complete silve
Electronics Forum | Wed Mar 30 16:46:03 EST 2005 | chunks
There is no spec because solder is designed to provide an electrical connection not a mechanical connection to hold the part on. If it where mechanical we�d be welding our parts on. Your pad width and length are derived from your component manufact
Electronics Forum | Wed Feb 05 20:56:23 EST 2003 | jonfox
I think you just answered a questioned that I never thought to ask. Are bulk parts manufactured differently than standard tape and reel parts? That would explain why there is a bigger price difference in parts from Murata and not from others. As I
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