Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef
Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept
Electronics Forum | Tue Aug 19 12:15:37 EDT 2003 | D Peter
Again, that is for packaging, rather than moisture removal or storage. Those guidlines are for several reasons, preventing low pressure outgassing or disassociation of the dessicants, damage to parts or wafer tray due to forces on the evacuated pack
Electronics Forum | Mon Sep 08 11:38:52 EDT 2014 | spoiltforchoice
They key requirement before any fancy tools is careful storage, stock control, labeling and handling. If your parts are incorrect before they even get to production, you're screwed. As gregp suggests, to get consistently correct value and orientation
Electronics Forum | Mon Oct 04 04:01:10 EDT 1999 | Chris May
| What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? | | How about curing bottom side first and reflowing top side later? | | What percentage of companies run reflow/cur
Electronics Forum | Fri Jan 21 18:47:14 EST 2000 | Ashok Dhawan
This massage is for clarifications on storage and handling of Moisture sensitive parts: Does chip resistors,capacitors and inductors need vacuum packing during usage life? For repacking of FPDs to limit reuse, is it necessary to use vacuum seler or s
Electronics Forum | Mon Oct 04 07:47:34 EDT 1999 | park kyung sam
| | What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? | | | | How about curing bottom side first and reflowing top side later? | | | | What percentage of companies run
Electronics Forum | Fri Jul 10 15:27:10 EDT 1998 | John Bashe
50k chips each, which is equal to (5) 7" reels). These are the 2 main influences on practical machine efficiencies. Additionally, storage areas for component inventories can be significantly reduced in size. The never-ending drive to reduce the cost
Electronics Forum | Sat Jun 11 07:24:26 EDT 2005 | buchi79
Russ, Thanks.By the way, i already look into the reflow profile & paste storage & thowing requirement. Even i cut down the stencil life to 4 hr to avoid any moisture absorbtion. If i were to change the paste formulation, what would you propose ? But
Electronics Forum | Thu Sep 03 18:48:52 EDT 1998 | Pete Sorenson
| I am in need of possible causes and solutions to capacitors that are failing in the field. | Are there issues in our process that need to be | checked? | Some people said the problems are due to improper | storage. Others say it is thermal stre
Electronics Forum | Fri Oct 06 09:25:57 EDT 2000 | Kev Head
Most places I've seen don't do anything special. But then again most places only have chip components on the bottom of their boards along with some thru-hole. The best way to find out if you are going to delaminate is to talk to the board manufactu
