Electronics Forum: chip stress (Page 1 of 9)

Cracked ceramic chip capacitors.

Electronics Forum | Fri Apr 18 16:53:25 EDT 2003 | takfire

DST, What was the crack signature? Was the crack parallel with the internal electrodes or 45� with the terminal electrode? It is also important to determine the orientation of the failed caps on the PCB (in regards to depaneling). Perhaps the cap

BGA chip corner epoxy / adhesive?

Electronics Forum | Thu Dec 07 03:21:54 EST 2006 | Guest

Materials you see are corner bond adhesive, main purpose of this is mechanical shock absorber , it promotes additional adhession to lessen stress to solder joints incase device subjected to mechanical stress like dropping.By function, corner bond

Chip crack at what stress.

Electronics Forum | Thu Mar 14 06:27:58 EST 2002 | ericchua

Hi, I'm looking at one of the stress checker. But, before going to it, I could like to find out what is the stress to damand the chip ( capacitors ). Now the production is using hand to break to the board.

Chip crack at what stress.

Electronics Forum | Thu Mar 14 09:07:26 EST 2002 | cfraser

I can not tell you what the actual stress limits are. I can tell you that de-paneling PCB's by hand is a very poor choice. I have seen numerous accounts of cracked caps, resistors, and LED�s due to incorrect de-paneling procedures. I would recommend

Stress induced during V-score depaneling

Electronics Forum | Thu Jun 16 08:05:41 EDT 2011 | kenneth0

thats very close to the edge. it is preferable to have at least 3mm clearance to edge, or more ideally 5mm. If the chips are too near to the edges, you might want to modify the panel by routing through the area next to the chips. This would eliminate

Chip crack at what stress.

Electronics Forum | Thu Mar 14 09:21:38 EST 2002 | davef

You should be looking for a better method of depaneling your boards. Listen. If you breaking components, it's not the component. It's you. Either you are: * Applying too much force. * Bending the board too much. * Locating the components too clos

capacitor leakage

Electronics Forum | Wed Jul 10 18:19:42 EDT 2002 | davef

Flex cracking under the terminations is generally regarded as one of the primary causes of failure of ceramic chips. If you can see cracks in the solder joints from board flex, those chips are certainly strongly suspect, and you must assume there is

Cracks other than MLCC

Electronics Forum | Wed Nov 13 02:28:27 EST 2019 | trino

Hello, I am a Japanese engineer. I am sorry for my unskillful English. Have you ever encountered cracks in chip resistors or IC components due to board mechanical stress? Especially, I'm looking for a case in the PCBs Depaneling process(pizza cutte

Ceramic Chip Cap Processing

Electronics Forum | Tue Nov 18 07:37:35 EST 2003 | Chris Lampron

Good Morning Everyone, Recently we have received a directive from one of our customers regarding processing of ceramic chip caps. The directive states that soldering irons shall not be used to process or rework any ceramic chip cap anywhere in the p

Stress induced during V-score depaneling

Electronics Forum | Tue Jun 14 09:26:01 EDT 2011 | kenneth0

what is the clearance between the chips and the edges?

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