Electronics Forum | Wed Dec 15 15:55:05 EST 1999 | Mike Naddra
As a general guidline I would agree with a 10% aperature reduction on chip caps , resistors, and fine pitch provided correct land geometries. When soldering to HASL surface finishes. Three things you may want to consider ; the stencil thickness, the
Electronics Forum | Wed Dec 08 10:03:48 EST 1999 | Ken Daniels
I have a problem dispensing chip adhesive while boards are still hot from the topside process. Has anyone else seen this? Is it a matter of my material, or the machine (Fuji GL 5) or the mask. When I try to dispense I get a great deal of stringin
Electronics Forum | Tue Nov 09 13:57:08 EST 1999 | Dave F
Gary: Three things to look at in preparing do your lab work: 1 Delco uses boat-loads of array devices, use your contacts there for information. 2 SMTA Journal publishes much relaibility study information. 3 "Solder Joint Reliability of Bga, Csp, Fl
Electronics Forum | Sun Oct 31 23:58:54 EST 1999 | John A.
Do both sides of that board contain larger IC's and other large components or just one side?? If just one side contains large components, try running the side with the smaller components first, and then run the other side last. If that doesn't work
Electronics Forum | Sun Oct 03 18:26:17 EDT 1999 | park
What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? How about curing bottom side first and reflowing top side later? What percentage of companies run reflow/cure/wave for
Electronics Forum | Mon Sep 27 18:06:26 EDT 1999 | Scott Cook
| Does anyone have any figures on what % extra compnents should be supplied on chip components for a particular product build. Typicaly there is wastage due to dropout in loading, 1st board build and machine rejections. Is there any industry standard
Electronics Forum | Tue Sep 07 03:52:50 EDT 1999 | Wolfgang Busko
| My company is starting a prototype. The chips that will be used appear to be very sensitive. The vendor part number is Neta-40-2. | My question is what solder temp should be used for this part? | Any advice is appreciated. | THX. | | If you�re un
Electronics Forum | Thu Aug 26 07:35:32 EDT 1999 | Robert Meston
For space contracts we have to mount chip capacitors/ resistors etc 0.1 to 0.4 mm from the pad height. This is to compenstae for the CTE differential in the substrate/component and also to ensure cleanliness. Does anyone have any new ideas on how t
Electronics Forum | Wed Aug 04 14:32:02 EDT 1999 | Barney Whalen
| Hi all, | | What is the typical placement head pressure for the GSM1 for placing the micro / chip Scale BGAs ? | | Thanks | Upinder | ======= | Hello Upinder, The typical placement pressure for a GSM1 with Flex head is 150-170 grams. You can p
Electronics Forum | Fri Jul 23 10:33:14 EDT 1999 | Mark D. Milward
Has anyone had the experience of losing components after they have been placed by the HSP 4796 because of table movement. I've worked on the 4760s, 4780s, and 4785. I don't know if this is a problem or not. We are trying to determine if this a possib
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