Electronics Forum | Mon Dec 15 16:16:42 EST 2008 | davef
J-STD-001 requires that solderable surfaces of components and connectors be degolded prior to soldering. As proven methods for removal of the gold plating and replacing it with tin/lead, MIL-STD-2000 and J-STD-001 endorse[d] either: * Double dip (two
Electronics Forum | Tue Mar 24 20:25:18 EDT 2009 | davef
It is very common to use low residue flux with low-standoff parts. On the other hand, sure you can clean under low-standoff parts. We've talked about this previously. Search the fine SMTnet Archives to find threads like: http://www.smtnet.com/Forums
Electronics Forum | Fri May 01 08:15:36 EDT 2009 | davef
Scavenging Methods [Improve Solder Scavenging of Large Area-array Sites, SMT, Laurence Harvilchuck, process research engineer, Unovis Solutions, harvilch@unovis-solutions.com] Two common methods exist for scavenging residual solder on the site for s
Electronics Forum | Fri Jun 05 00:09:31 EDT 2009 | operator
I have been trying to get in touch with TI about their SMT RFID chips. I want to learn more about its capabilities and everything involved. I have read many articles on RFID in general, but finding specific info on the SMT application has been diffic
Electronics Forum | Wed Sep 16 18:25:47 EDT 2009 | larob57
(http://forums.xbox-scene.com/index.php?showtopic=691556) I can make some more pic's for you to see and I will post them in photobucket.Go to my page at this link and then click on my album (http://s1007.photobucket.com/albums/af192/repairman52/)
Electronics Forum | Mon Sep 21 18:37:10 EDT 2009 | sbayeta
Hi, Our SMT line has placement capacity of 80K cph, but only 21K cph gluing capacity. The rate between reflow and glue of our products is around 5 to 1. The line works great for the reflow boards, but when we produce glue boards the glue dispenser
Electronics Forum | Thu Mar 10 21:21:54 EST 2011 | thatguy
I have 7yrs experience with JUKI's and I liked 2000 series(2050,2060) dont get caught up in the 730 or 760 these machines are obsolete or at least on there way and spare parts are hard to come buy. The 2060 is the chip shooter. I like the user friend
Electronics Forum | Thu Apr 07 09:24:47 EDT 2011 | rway
What version of sw are you running? There are some new features in 2.7.7 and earlier that may be of benefit to you. With chip caps you are testing for presense/absense. The gain/offset feature can be used to give you better contrast between the pa
Electronics Forum | Sat Jun 04 12:11:49 EDT 2011 | davef
Q1) How to identify on good or bad RF shield that could contribute to dewetting? A1) We use Alloy 770 and 752 [German silver] for our RF shields. We have never seen a solderability issue, even aged stock solders well. * Nickel Alloy 752, Nickel Silv
Electronics Forum | Fri Jun 17 16:15:41 EDT 2011 | rway
One problem you may have with deeper scoring is not so much broads breaking apart unintentionally, but warping upstream while on the SMT line which can cause sagging. This may give you transport issues from one machine to another, and if you have an
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