Electronics Forum | Tue Aug 17 11:28:07 EDT 2004 | rlackey
Hi, I'm not the expert DaveF is, however I have seen quite a few cracked chip capaictors in my time - most of these were from lack of Z height adjustment on a turret chipshooter to compensate for various thickness. Do you have separate 1206 thick
Electronics Forum | Tue Oct 18 15:50:01 EDT 2022 | smith88
IPC states chips and cracks in glass body are defective if beyond specifications. Chips or cracks in glass body beyond the part specification, see Figure 9-18. • Cracked or damaged glass bead beyond part specification (not shown). On some glass
Electronics Forum | Sun May 26 02:06:39 EDT 2019 | jlawson
Placement force can cause chip cracking-micro cracks also. As machines are getting faster they tend to not control force other than spring pressures and z displacements. There are some machines that have full closed loop place pressure control , but
Electronics Forum | Mon Feb 06 17:58:16 EST 2023 | davef
The September 29, 2022 Express Newsletter [ https://smtnet.com/express/index.cfm?fuseaction=archives&issue=20220929 ] has papers on chip cracking
Electronics Forum | Thu Mar 14 06:27:58 EST 2002 | ericchua
Hi, I'm looking at one of the stress checker. But, before going to it, I could like to find out what is the stress to damand the chip ( capacitors ). Now the production is using hand to break to the board.
Electronics Forum | Thu Mar 02 13:20:26 EST 2006 | inds
jagman, take a hard look at a capacitor under the high mag microscope before you start assembling it.. I remembering seeing cracks even before the assembly. apparently all chip capacitors have crack at the intersection between the capacitor head and
Electronics Forum | Tue Feb 28 16:09:27 EST 2006 | outgasser
Does anyone have any insight as to the cause of cracked chip capacitors during SMT? Z-stop? Thermal shock? Any help is appreciated.
Electronics Forum | Thu Oct 07 07:53:54 EDT 2004 | Mark
http://www.smtnet.com/Forums/index.cfm
Electronics Forum | Sun Nov 15 21:18:11 EST 1998 | Pattana Sirivunnasan
I would like to know about specification for accept or reject LED which have defect such as,chip ,crack ,etc. this type of LED is surface mount device type. Thank you for your help.
Electronics Forum | Wed Dec 05 18:28:54 EST 2012 | cnotebaert
what type of part is this a micro BGA by chance? there is a mill spec (man I cant remember it right now), I'll get back to you! it provides acceptance criteria for chip/crack/gouges.... if it doesn’t expose the lead frame (inner workings of the devic
