Electronics Forum | Wed Jan 09 15:24:49 EST 2002 | mregalia
Thanks Chris. As I was writing my last message our mailperson dropped off the latest issue of Circuit Assembly. It has an article on mixing SMT and COB on the same board. The author recommends as a compromise 10-20 micro inches of gold over 70-100 of
Electronics Forum | Thu Feb 14 20:24:07 EST 2002 | scott
My first reaction would be to run! FAST! Flex -- well, it... flexes... and isn't flat. While you assemble it, While you transport it, While it goes through the oven... SMT Connectors typically need to be held down during reflow. Fiducial types are
Electronics Forum | Tue Nov 12 12:49:55 EST 2002 | dragonslayr
Use an "LCR" (L= inductance, C= capacitance, R= Resistance)meter. There are several name brands to choose from (Fluke, etc.) Hand held units are relatively inexpensive. In fact, you may consider having more than one available. Receiving inspection s
Electronics Forum | Wed Nov 13 22:30:05 EST 2002 | davef
Methods for performing repairs: * 7721 - Repair & Modification of Printed Boards & Electronic Assemblies. * On-line guides at Circuit Repair Technology [ http://www.circuittechctr.com ] site. Roughly from East to West, service companies that perfor
Electronics Forum | Mon Mar 03 14:48:11 EST 2003 | genny
I've never heard of a customer saying just 'we want decoupling caps'. Very interesting. In RF applications - frequencies 50MHz up into several GHz, the location of where they are put is just as important as what the value is. Decoupling caps are p
Electronics Forum | Wed Dec 10 15:18:44 EST 2003 | Dustin
My name is Dustin Steedman. I have a Direct Hire position available in Michigan. I realize that you may be currently employed. However, I am sending you this email with the hope that you or someone that you know would be interested in this current op
Electronics Forum | Wed Dec 10 15:21:37 EST 2003 | Dustin
My name is Dustin Steedman. I have a Direct Hire position available in Michigan. I realize that you may be currently employed. However, I am sending you this email with the hope that you or someone that you know would be interested in this current op
Electronics Forum | Mon May 10 16:37:01 EDT 2004 | davef
First some definitions, the two main types for solder masking near BGA pads are: 1 Pad, Non-Solder Mask Defined. In circuit board design, pads with spacing that does not allow solder (usually bumps) on the pads to contact the adjacent solder mask. [
Electronics Forum | Fri May 14 11:17:42 EDT 2004 | Ashok Dhawan
I am having coating adhesion problem with flex circuits. The cover plate material is KAPTON or Poly imide. The conformal coating material used is humiseal 2A64. The boards are cleaned, measuring less than 4 microgram Nacl per sq in. against acceptabl
Electronics Forum | Fri Aug 06 08:38:25 EDT 2004 | Bob R.
You don't mention the board surface finish, but BGA's on NiAu are prone to brittle fracture in the Sn-Ni intermetallic on the board side of the joint. You may not be able to see it visually, but it would show up in a cross-section. In-circuit test
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