Electronics Forum | Mon May 10 16:37:01 EDT 2004 | davef
First some definitions, the two main types for solder masking near BGA pads are: 1 Pad, Non-Solder Mask Defined. In circuit board design, pads with spacing that does not allow solder (usually bumps) on the pads to contact the adjacent solder mask. [
Electronics Forum | Fri May 14 11:17:42 EDT 2004 | Ashok Dhawan
I am having coating adhesion problem with flex circuits. The cover plate material is KAPTON or Poly imide. The conformal coating material used is humiseal 2A64. The boards are cleaned, measuring less than 4 microgram Nacl per sq in. against acceptabl
Electronics Forum | Fri Aug 06 08:38:25 EDT 2004 | Bob R.
You don't mention the board surface finish, but BGA's on NiAu are prone to brittle fracture in the Sn-Ni intermetallic on the board side of the joint. You may not be able to see it visually, but it would show up in a cross-section. In-circuit test
Electronics Forum | Tue Oct 26 13:40:47 EDT 2004 | Paul_pmd
Have the SOIC tested by independant. Clarify as to weather or not you have run this board before. Check to see if the board has been rev'ed. Sometimes IC's are rated at a clock speed or by axcess time. Engneering on this board may be at the tolorance
Electronics Forum | Sat May 28 19:54:20 EDT 2005 | MikeaJ
I agree with Ken, the root cause could very well be obvious. However, take a look at the following items, these checks only take a minute to accomplish. 1. If your stepper drivers are the older 5410 Pac Sci modules, check for melted power connectors
Electronics Forum | Tue Feb 28 20:56:12 EST 2006 | davef
Here you go ... PCB FR-4 Inspection Manual 1 Introduction This defines the minimum acceptability requirements. It is not intended for use as a performance specification for the Company or procurement. It is based on the requirements of Acceptabi
Electronics Forum | Fri Jun 09 11:55:34 EDT 2006 | jbrower
Howdy Amol, As far as I can see, there aren't too many pitfalls with SN100C. Just make sure to keep all of your alloys seperated. The issues that I am working out right now is the profiles with our wave pallets and some of our larger components. We
Electronics Forum | Fri Nov 03 11:36:34 EST 2006 | mika
Hi, It is good news to "hear" that You found the problem. This control board has also broken for us once but we had a broken camera unit from where we took this board as a replacement. Unfortunately I was not able to find the circuit diagram (among a
Electronics Forum | Sun Mar 09 09:15:21 EDT 2008 | davef
Q1. What kind of labels/ink/sharpe can be used under conformal coating without disolving etc...? A1. While we're not familiar with the conformal coat you have selected, this might help. Label selection: The following chemically durable materials are
Electronics Forum | Wed May 07 21:20:53 EDT 2008 | davef
Causes of Delamination ["Quality Assessment of Printed Circuit Boards" Lund, Preben; Bishop Graphics 1985 0137450354] The reason for delamination is epoxy starvation in the glass cloth layers or an incomplete curing of the base material. It has been
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